Effect of Sintering Temperature on the Residual Stress of SrO-MgO-SiO2 Glass-Ceramic Sealant for Solid Oxide Fuel Cells

Kai Hu,Jiankang Zhou,Xiucheng Zhang,Xiang Xing,Bi Wang,Zhihui Liu,Yuming Wang,Zixi Wang
DOI: https://doi.org/10.1007/s11665-024-09475-7
IF: 2.3
2024-05-18
Journal of Materials Engineering and Performance
Abstract:One of the critical issues in the efficient operation of the solid oxide fuel cell (SOFC) is the interface fracture caused by the release process of the residual stress inside the sealant in the thermal cycle. The effects of sintering temperature at 700, 750, 800 and 850 °C on the residual stress caused by the crystallization process of SrO-MgO-SiO 2 glass-ceramic were investigated systematically. The structure evolution was observed using the SEM equipped with EDS, and the phase composition was detected by the XRD and Raman spectrum. The residual stress was characterized using XRD, Raman spectroscopy and nanoindentation methods. The results showed that the sintering process promoted the crystallization process. The Sr 2 MgSi 2 O 7 phase was formed at the range from 735 to 847 °C, which improved the mechanical properties and formed residual stress. The XRD and Raman peaks shifted toward the high angle, indicating that the residual compressive stress was caused by the lattice mismatch of the crystal phase. With the sintering temperature increasing from 750 to 850 °C, the residual stress values changed from − 867.472 to − 113.338 MPa in the (211) plane by the XRD method. The redshift of 901 cm −1 Raman peak indicated the residual compressive stress decreased from − 355.6 for SMS-800 to − 101.6 MPa for SMS-850. The left displacement in the nanoindentation experiment also suggested compressive stress in the SMS-750, SMS-800 and SMS-850 with a value of − 307.691, − 227.244 and − 175.161 MPa, respectively. However, a residual tensile stress existed in the SMS-700. As the sintering temperature increased, the compressive stress of SMS-850 had a decrease of 43% compared with SMS-750. The fracture toughness of SMS-850 reached the maximum of 1.12 MPa·m 1/2 due to the crystal phase increase and residual stress reduction.
materials science, multidisciplinary
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