Residual Strain of Silicon-on-AlN Novel Structure

门传玲,徐政,安正华,林成鲁
DOI: https://doi.org/10.3321/j.issn:0253-374x.2003.03.024
2003-01-01
Abstract:Self heating effects in silicon on insulator (SOI) devices limit the applicability of SOI materials in electronics in cases where high power consumption is expected.AlN becomes a promising alternative to SiO 2 layer in traditional SOI materials.For the first time,a novel silicon on aluminum nitride (SOAN) structure has been fabricated by the smart cut process to alleviate the self heating effects.The AlN films were synthesized on 10.16 cm(4 in) Si(100) substrate by ion beam enhanced deposition (IBED) technique,followed by the smart cut process.Cross sectional transmission electron microscope (XTEM) micrograph confirms the formation of the SOAN structure.high resolution X ray diffraction (HRXRD) was employed to study the residual strain in the formed SOAN structure indicating that the residual lattice strain in the top silicon layer varied from tensile to little compressive after as received SOI samples annealed at 1 100 ℃ for an hour.
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