ESD protection design of DDSCR structure based on the 0.5 BCD process

梁海莲,董树荣,顾晓峰,李明亮,韩雁
DOI: https://doi.org/10.3785/j.issn.1008-973X.2013.11.024
2013-01-01
Abstract:Since the dual directional silicon controlled rectifier (DDSCR) can not meet the requirement of the narrow electrostatic discharge (ESD) design window in integrated circuits with progressively decreasing feature sizes, an ESD protection device of PMOS-embedded gate-floating DDSCR (GFDDSCR) was designed and fabricated based on the 0.5 μm Bipolar-CMOS-DMOS process. The ESD characteristics of GFDDSCR devices with different key dimensions were studied by transmission line pulse testing, and their unit area ESD protection ability was calculated. The structure parameters of GFDDSCR were optimized by investigating the effects of key dimensions on the ESD characteristics. Results show that, compared with the improved bi-directional silicon controlled rectifier (IBDSCR), the optimized GFDDSCR has a small change in the holding voltage and the failure current, a lower trigger voltage decreased by about 27%, and a narrower voltage snapback margin decreased by about 53%. As a result, the optimized GFDDSCR can meet the requirement of the narrow ESD design window in micro-nano scaled integrated circuits.
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