Three-Step Growth of Metamorphic Gaas on Si(001) by Low-Pressure Metal Organic Chemical Vapor Deposition

Yifan Wang,Qi Wang,Zhigang Jia,Xiaoyi Li,Can Deng,Xiaomin Ren,Shiwei Cai,Yongqing Huang
DOI: https://doi.org/10.1116/1.4820914
2013-01-01
Abstract:In this study, metamorphic growth of GaAs on Si(001) substrate was investigated via three-step growth in a low-pressure metal organic chemical vapor deposition reactor. Three-step growth was achieved by simply inserting an intermediate temperature GaAs layer between the low temperature GaAs nucleation layer and the high temperature GaAs epilayer. Compared with conventional two-step growth, three-step growth could further reduce surface roughness and etch pit density. By combining three-step growth with thermal-cycle annealing, the authors have grown a 1.8-μm-thick GaAs epilayer with root mean square roughness of only 1.8 and 0.73 nm in 10 × 10 μm2 and 2 × 2 μm2 scanning areas, respectively. The threading dislocation density of the 1.8-μm-thick GaAs epilayer was as low as 1.1 × 107 cm−2, as calculated directly from the double crystal x-ray diffraction ω-scan full width at half maximum of the GaAs diffraction peak. The corresponding etch pit density was only 3 × 106 cm−2.
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