Development of Multi-Layer Fabrication Process for SFQ Large Scale Integrated Digital Circuits
Liliang Ying,Xue Zhang,Minghui Niu,Jie Ren,Wei Peng,Masaaki Maezawa,Zhen Wang
DOI: https://doi.org/10.1109/tasc.2021.3065277
IF: 1.9489
2021-08-01
IEEE Transactions on Applied Superconductivity
Abstract:We have developed a fabrication technology for superconducting integrated circuits withNb-based Josephson junctions. The standard fabrication process with 10 mask levels includes 3Nb superconducting layers and a Mo resistor layer. The influence of deposition parameters on film stress, electrical properties, and surface roughness were studied systematically. High qualityNb, Al, Mo, and SiO2 films were successfully deposited for the subsequent fabrication of circuits. The circuit fabrication started with the fabrication of Mo resistors with a target sheet resistance Rsh of 2 , followed by the deposition ofNbAl-AlOxNb trilayer Josephson-junction. The target critical current density Jc was set at 6 kAcm2. Small-scale circuits such as our standard library cells have been successfully fabricated and tested, confirming the capability of our fabrication technology for superconducting integrated circuits.
physics, applied,engineering, electrical & electronic