Fabrication of high quality Al/AlO_x/Al Josephson junctions

Fang Yurong,Cao Chunhai,Xu Qinyin,Wang Lin,Zhang Guanghan,Yao Xiaodong,Xu Weiwei,Sun Guozhu,Wu Peiheng
DOI: https://doi.org/10.3969/j.issn.1001-7100.2013.09.012
2013-01-01
Abstract:Al/AlOx/Al tunnel junctions were fabricated on high resistivity silicon substrate.The Al / AlO x / Al layers were deposited by electron beam evaporation,and the base and top electrodes or circuit connection lines were defined by chemical wet etching.The two layers of Al were deposited by electron beam evaporation and the barrier layer was fabricated by delivering oxygen after the first layer of Al was deposited.Insolation layer(SiO 2) was prepared by PECVD to protect junctions,while top electrode window was opened by RIE.We measured Al/AlOx/Al tunnel junction samples at 400mK,and obtained the preferable IV curve of tunnel junction,which shows that gap voltage as 0.325mV,critical current I c as 55nA and leakage curent as 5nA.
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