Implementation of Fully Self-Aligned Bottom-Gate MOS Transistor

SD Zhang,RQ Han,ZK Zhang,R Huang,PK Ko,MS Chan
DOI: https://doi.org/10.1109/led.2002.803763
IF: 4.8157
2002-01-01
IEEE Electron Device Letters
Abstract:This letter reports the implementation of the bottom-gate MOSFET, which possesses the following fully self-aligned structural features: 1) self-aligned source-drain to bottom-gate; 2) self-aligned thick source-drain and thin channel; and 3) self-aligned and mask-free lightly doped drain (LDD). The complete self-alignment is realized by combining a conventional ion implantation and a subsequent chemo-mechanical polish (CMP) step. The process is applied to the poly-Si film that is crystallized from an a-Si film deposited by [AUTHOR: Please define]: LPCVD using metal-induced unilateral crystallization technique and is grain-enhanced further in a high temperature annealing step. Deep submicron fully self-aligned bottom-gate pMOS transistors with channel length less than 0.5 mum are fabricated. The measured performance parameters include threshold voltage of -0.43 V, subthreshold swing of 113 mV/dec, effective hole mobility of 147 cm(2)/V-s, off-current of 0.17 pA/mum, and on-off current ratio of 7.1 x 10(8).
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