A Self-Aligned Double-Gate Mos Transistor Technology with Individually Addressable Gates

SD Zhang,XN Lin,R Huang,RQ Han,PK Ko,YY Wang,MS Chan
DOI: https://doi.org/10.1109/soi.2002.1044478
2002-01-01
Abstract:Double-gate (DG) SO1 MOSFET has been considered the most promising device for extremely scaled CMOS technology generations [1-3]. Another attractive feature of the DG MOSFET is its ability to dynamically control the threshold voltage to achieve both high performance and low power consumption [4]. While the DG device has many advantages, the fabrication process, especially, the self-aligned (SA) process has been shown to be extremely difficult [5-81. And, the two gates of the SADG devices fabricated so far could not hehdividually biased. Nevertheless, a DG configuration with the two gates electrically separated is necessary for some applications such as the dynamic threshold voltage control. In this work, a relatively simple self-aligned electrically separable double-gate (SA ESDG) MOS transistor technology is reported.
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