Abstract:A snapback-free and high-performance trench gate reverse conducting (RC) lateral insulated gate bipolar transistor based on silicon-on-insulator (SOI-LIGBT) is proposed. With an integrated Schockley diode, the RC and snapback-free forward conducting are accomplished. With a self-adaptive trench gate nMOS, fast and soft reverse recovery as well as low peak forward recovery voltage ( ${V}_{\text {FRM}}{)}$ is achieved for the diode mode, and low turn-off loss ( ${E}_{\text {off}}{)}$ is achieved for the lateral insulated gate bipolar transistor (LIGBT) mode. With a self-adaptive planar gate nMOS, the forward ON-state voltage drop ( $\left(V_{\mathrm{CE}(s a t)}\right)$ can be reduced. By using a deep trench with p-ring (DTP), high dynamic avalanche immunity (DAI) is obtained. The trench gate DAI LIGBT combined with a p-i-n diode with a DPT (DTP p-i-n diode) is used for comparison, where the total area of the proposed RC-IGBT is reduced by 42%. Simulation results show that the proposed RC-LIGBT can safely turn off under 100% breakdown voltage and reduce ${E}_{\text {off}}$ by 60% compared to the DAI LIGBT. The reverse recovery charge ( ${Q}_{\text {rr}}{)}$ of the proposed RC-LIGBT is 38% of the DTP p-i-n diode and 19% of the conventional p-i-n diode. The reverse recovery softness ( ${S}{)}$ is increased to 1.05 compared to the DTP p-i-n diode ( ${S}$ = 0.14) and the conventional p-i-n diode ( ${S}$ = 0.11).

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