33 Mu M Free Standing Thick Film Vertical Structure Led Made By Laser Lift-Off

Yongjian Sun,Shengli Qi,Zhizhong Chen,Xingning Kang,Guangmin Zhu,Cheng Chen,Shitao Li,Yaobo Pan,Jianfeng Yan,Junjing Deng,Hao Long,Maosheng Hao,Tongjun Yu,Guoyi Zhang
DOI: https://doi.org/10.1002/pssc.200880791
2009-01-01
Abstract:The 33 mu m thick film vertical structure LEDs without any substrate were fabricated and their free standings were successfully realized by laser lift-off and HVPE technology. Through the AFM analyses we know that the laser irradiation can causes big damage to the wafer. However, since the 33 mu m thick film vertical structure LEDs without any substrate have longer distance between the laser irradiating plane and the quantum well than the the thin film (3-4 mu m) vertical structure LED on Cu or Si substrate, the 33 mu m free standing thick film vertical structure LEDs exhibited good electrical and optical characteristics for the less damage on the quantum well caused by the laser lift off process. It has also been proved that the 33 mu m thick film vertical structure LEDs without any substrate has lower thermal series resistance than the vertical structure LEDs on 300-400 mu m free standing GaN substrate. (C) 2009 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim
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