Abstract:The advancement of laser lift‐off (LLO) technologies proposed in the field of semiconductors require enhanced comprehensive exploration and fundamental understanding of the complex mechanisms of laser‐matter interactions. The photothermal effects, "cold" processing, shock waves, and cavitation effects in LLO processes are focused on, and are dedicated to discussing their latest progress, sustainable applications, challenges, and new approaches in emerging electronics. Due to the advantages of non‐contact processing, high efficiency, high precision, and superior controllability, laser lift‐off (LLO) technologies exhibit excellent material applicability and process compatibility in the lift‐off of ultra‐thin electronic devices. This brings new opportunities for large‐scale manufacturing of emerging electronics that meet ultra‐thin, fragile, and poor high‐temperature resistance. However, this opportunity also comes with formidable challenges from the complex mechanisms of laser‐matter interactions, which hinder comprehensive exploration and fundamental understanding. By elaborating the laser‐material interactions, the photothermal effect, "cold" processing, shockwave effect, and cavitation effect in LLO process from multiple perspectives, this review is devoted to discussing the latest progress and sustainable application of LLO technologies in emerging electronics that are developing toward ultra‐thin, miniaturization, and integration, such as wafer level packaging, displays, energy harvesters, sensors, and memories. Finally, starting from the fundamental principles of material design, light field regulation, and intelligent control system, the challenges and new approaches faced by LLO technologies are explored and fully integrated with future innovative manufacturing concepts and device structures.

Influences of Laser Lift-off Process on the Performances of Large-Area Light-Emitting Diodes

Study of GaN light-emitting diodes fabricated by laser lift-off technique

Comparative Analysis of Optoelectrical Performance in Laser Lift-Off Process for GaN-Based Green Micro-LED Arrays

The impact of laser lift-off with sub-ps pulses on the electrical and optical properties of InGaN/GaN light-emitting diodes

Thin Film GaN-Based LEDs on Cu Substrates Fabricated by Laser Lift-Off

GaN-Based Thin Film Vertical Structure Light Emitting Diodes Fabricated by a Modified Laser Lift-off Process and Transferred to Cu

P‐85: Development of High‐yield Laser Lift‐off Process for Micro LED Display

Enhanced Performance of Large-Area Vertical Light-Emitting Diodes Treated by Laser Irradiation

Improvement of light extraction from GaN-based thin-film light-emitting diodes by patterning undoped GaN using modified laser lift-off

Vertical Electrode Structure GaN Based Light Emitting Diodes

Laser Lift‐Off Technologies for Ultra‐Thin Emerging Electronics: Mechanisms, Applications, and Progress

Effect of Carbon Nanotube Pattern on the Laser Lift off and Quantum Efficiencies of Near UV Vertical LEDs

Cathodoluminescence Study of InGaN MQW Laser Diodes Using Laser Lift‐off Technique

Microanalyses of the Reverse-Bias Leakage Current Increase in the Laser Lift off GaN-based Light Emitting Diodes

Carbon Nanotube Assisted Lift off of GaN Layers on Sapphire

33 Mu M Free Standing Thick Film Vertical Structure Led Made By Laser Lift-Off

Study on Light Extraction from GaN-based Green Light-Emitting Diodes Using Anodic Aluminum Oxide Pattern and Nanoimprint Lithography

Femtosecond Laser Lift‐Off with Sub‐Bandgap Excitation for Production of Free‐Standing GaN Light‐Emitting Diode Chips

Study Of The Structural Damage In The (0001) Gan Epilayer Processed By Laser Lift-Off Techniques

Laser lift-off technique for applications in III-N microelectronics: A review

High-yield Micro-LED laser transfer accomplished using an ablation-type release material