On the Single-Chip Condenser Miniature Microphone Using DRIE and Backside Etching Techniques

J Chen,LT Liu,ZJ Li,ZM Tan,Y Xu,J Ma
DOI: https://doi.org/10.1016/s0924-4247(02)00326-6
2003-01-01
Abstract:A novel single-chip condenser miniature microphone with a circular corrugated diaphragm for residual stress releasing has been proposed, fabricated and tested. The condenser microphone consists of a rigid single-crystal backplate and a flexible circular corrugated diaphragm using DRIE and backside etching techniques. An electrostatic–structural coupling finite element analysis (FEA) was performed for design optimization and evaluation. A sensitivity of 40mV/Pa up to 15kHz has been achieved under a low bias voltage of 14V, which is among the best in the presented reports.
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