Abstract:Abstract Since the performance of micro-electro-mechanical system (MEMS)-based microphones is approaching fundamental physical, design, and material limits, it has become challenging to improve them. Several works have demonstrated graphene’s suitability as a microphone diaphragm. The potential for achieving smaller, more sensitive, and scalable on-chip MEMS microphones is yet to be determined. To address large graphene sizes, graphene-polymer heterostructures have been proposed, but they compromise performance due to added polymer mass and stiffness. This work demonstrates the first wafer-scale integrated MEMS condenser microphones with diameters of 2 R = 220–320 μ m, thickness of 7 nm multi-layer graphene, that is suspended over a back-plate with a residual gap of 5 μ m. The microphones are manufactured with MEMS compatible wafer-scale technologies without any transfer steps or polymer layers that are more prone to contaminate and wrinkle the graphene. Different designs, all electrically integrated are fabricated and characterized allowing us to study the effects of the introduction of a back-plate for capacitive read-out. The devices show high mechanical compliances C m = 0.081–1.07 μ mPa −1 (10–100 × higher than the silicon reported in the state-of-the-art diaphragms) and pull-in voltages in the range of 2–9.5 V. In addition, to validate the proof of concept, we have electrically characterized the graphene microphone when subjected to sound actuation. An estimated sensitivity of S 1 k H z = 24.3–321 mV Pa −1 for a V b i a s = 1.5 V was determined, which is 1.9–25.5 × higher than of state-of-the-art microphone devices while having a ~9 × smaller area.

Design and implementation of a novel CMOS MEMS condenser microphone with corrugated diaphragm

Implementation of the CMOS MEMS Condenser Microphone with Corrugated Metal Diaphragm and Silicon Back-Plate

DESIGN AND IMPLEMENTATION OF A CMOS-MEMS MICROPHONE WITHOUT THE BACK-PLATE

Study of a highly sensitive miniature condenser microphone based on MEMS technology

Theoretical and Experimental Studies of Single-Chip-Processed Miniature Silicon Condenser Microphone with Corrugated Diaphragm

Fabrication of a novel structural miniature silicon condenser microphone

Single-chip Condenser Miniature Microphone with a High Sensitive Circular Corrugated Diaphragm

Design And Fabrication of Condenser Microphone Using Wafer Transfer And Micro-electroplating Technique

Development Of A Cmos Compatible Process For Silicon Miniature Microphone With A High Sensitivity

Development Of A No-Back-Plate Soi Mems Condenser Microphone

On the Single-Chip Condenser Miniature Microphone Using DRIE and Backside Etching Techniques

Study of corrugated diaphragms used in silicon condenser microphones

Novel in-plane gap closing CMOS-MEMS microphone with no back-plate

SENSITIVITY IMPROVEMENT OF NO-BACK-PLATE MEMS MICROPHONE USING POLYSILICON TRENCH-REFILLED PROCESS

High-performance condenser microphone with fully integrated CMOS amplifier and DC-DC voltage converter

Design and Implementation of A Capacitive-Type Microphone with Rigid Diaphragm and Flexible Spring Using the Two Poly Silicon Micromachining Processes

Design and implementation of a novel double-poly microphone with rigid acoustic receiver, flexible spring supporter, and harm backplate

Design and Implementation of Differential MEMS Microphones Using the Two Polysilicon Processes for SNR Enhancement

Bandwidth and SNR Enhancement of MEMS Microphones Using Two Poly-Si Micromachining Processes

Highly-sensitive wafer-scale transfer-free graphene MEMS condenser microphones

A Compact MEMS Microphone Digital Readout System Using LDO and PPA-Less VCO-Based Delta-Sigma Modulation Technique