Abstract:A novel type of silicon condenser microphone with corrugated diaphragm has been designed, fabricated and tested. The microphone can be fabricated on a single wafer by using silicon anisotropic etching and sacrificial layer etching techniques. The introduction of well performed corrugation has strongly increased the mechanical sensitivity of the microphone diaphragm because of the reduction of the stress in thin films. Corrugations with different q values have been investigated, showing a close relationship between the ratio of the depth of the corrugation to the diaphragm thickness and the mechanical sensitivity of the diaphragm. For the purpose of further decreasing thin film stress, composite diaphragm has been fabricated, reducing the initial stress to a much lower level of about 70MPa in tension. Three types of corrugation placements in a diaphragm area of 1mm2 have been fabricated. Microphones with higher than 10kHz bandwidth and sensitivity of 6.8-16.0mV/Pa under a relatively low bias voltage of about 5-15V have been fabricated. The experiments prove that the corrugation technique is promising for silicon condenser microphone.

Theoretical and Experimental Studies of Single-Chip-Processed Miniature Silicon Condenser Microphone with Corrugated Diaphragm

Fabrication of a novel structural miniature silicon condenser microphone

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Study of corrugated diaphragms used in silicon condenser microphones

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Implementation of the CMOS MEMS Condenser Microphone with Corrugated Metal Diaphragm and Silicon Back-Plate

Design and implementation of a novel CMOS MEMS condenser microphone with corrugated diaphragm

Design And Fabrication of Condenser Microphone Using Wafer Transfer And Micro-electroplating Technique

Development Of A Cmos Compatible Process For Silicon Miniature Microphone With A High Sensitivity

A Micro-machined Condenser Microphone with Polysilicon Diaphragm

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SENSITIVITY IMPROVEMENT OF NO-BACK-PLATE MEMS MICROPHONE USING POLYSILICON TRENCH-REFILLED PROCESS

Miniature Microphone With Silicon-Based Ferroelectric Thin Films

Development Of A No-Back-Plate Soi Mems Condenser Microphone

Research on Bulk Silicon Etching for Piezoelectric Miniature Microphone and Capacitive Miniature Microphone

DESIGN AND IMPLEMENTATION OF A CMOS-MEMS MICROPHONE WITHOUT THE BACK-PLATE

A review of silicon microphones

Dynamic Characteristics of Novel Single-Chip Fabricated Corrugated Diaphragms for Micro-Acoustic Devices

High-performance condenser microphone with fully integrated CMOS amplifier and DC-DC voltage converter

Dynamic Behaviour of Miniature Microphone with Corrugated Membrane:Top-down Design with EDA/CAD