Abstract:Abstract Since the performance of micro-electro-mechanical system (MEMS)-based microphones is approaching fundamental physical, design, and material limits, it has become challenging to improve them. Several works have demonstrated graphene’s suitability as a microphone diaphragm. The potential for achieving smaller, more sensitive, and scalable on-chip MEMS microphones is yet to be determined. To address large graphene sizes, graphene-polymer heterostructures have been proposed, but they compromise performance due to added polymer mass and stiffness. This work demonstrates the first wafer-scale integrated MEMS condenser microphones with diameters of 2 R = 220–320 μ m, thickness of 7 nm multi-layer graphene, that is suspended over a back-plate with a residual gap of 5 μ m. The microphones are manufactured with MEMS compatible wafer-scale technologies without any transfer steps or polymer layers that are more prone to contaminate and wrinkle the graphene. Different designs, all electrically integrated are fabricated and characterized allowing us to study the effects of the introduction of a back-plate for capacitive read-out. The devices show high mechanical compliances C m = 0.081–1.07 μ mPa −1 (10–100 × higher than the silicon reported in the state-of-the-art diaphragms) and pull-in voltages in the range of 2–9.5 V. In addition, to validate the proof of concept, we have electrically characterized the graphene microphone when subjected to sound actuation. An estimated sensitivity of S 1 k H z = 24.3–321 mV Pa −1 for a V b i a s = 1.5 V was determined, which is 1.9–25.5 × higher than of state-of-the-art microphone devices while having a ~9 × smaller area.

Study of a highly sensitive miniature condenser microphone based on MEMS technology

Theoretical and Experimental Studies of Single-Chip-Processed Miniature Silicon Condenser Microphone with Corrugated Diaphragm

Single-chip Condenser Miniature Microphone with a High Sensitive Circular Corrugated Diaphragm

Design and implementation of a novel CMOS MEMS condenser microphone with corrugated diaphragm

Implementation of the CMOS MEMS Condenser Microphone with Corrugated Metal Diaphragm and Silicon Back-Plate

Fabrication of a novel structural miniature silicon condenser microphone

On the Single-Chip Condenser Miniature Microphone Using DRIE and Backside Etching Techniques

Design, Simulation and Optimization of a Highly Sensitive Micromachined Membrane

Study of corrugated diaphragms used in silicon condenser microphones

Design And Fabrication of Condenser Microphone Using Wafer Transfer And Micro-electroplating Technique

DESIGN AND IMPLEMENTATION OF A CMOS-MEMS MICROPHONE WITHOUT THE BACK-PLATE

SENSITIVITY IMPROVEMENT OF NO-BACK-PLATE MEMS MICROPHONE USING POLYSILICON TRENCH-REFILLED PROCESS

Development Of A No-Back-Plate Soi Mems Condenser Microphone

Development Of A Cmos Compatible Process For Silicon Miniature Microphone With A High Sensitivity

Highly-sensitive wafer-scale transfer-free graphene MEMS condenser microphones

A New Measurement Microphone Based on Mems Technology

Dynamic Behaviour of Miniature Microphone with Corrugated Membrane:Top-down Design with EDA/CAD

A Study on Packaging of PZT MEMS Microphone

Implementation of piezoelectric mems microphone for sensitivity and sensing range enhancement

Micro-Electro-Mechanical Systems Microphones: A Brief Review Emphasizing Recent Advances in Audible Spectrum Applications

A Modeling and Feasibility Study of a Micro-Machined Microphone Based on a Field-Effect Transistor and an Electret for a Low-Frequency Microphone