Abstract:This study introduces a double‐layer metallization strategy using silver as a seed layer with nickel and copper forming the bulk, offering a cost‐effective alternative to traditional silver contacts in silicon solar cells. Demonstrating a substantial reduction in silver usage to below 2.5 mg/Wp, the novel approach promises to significantly lower manufacturing costs without compromising performance. Microstructural analysis and peel force tests confirm the integrity of the contacts, indicating no copper diffusion into the silicon during the firing process. Efficient metal contact formation is pivotal for the production of cost‐effective, high‐performance crystalline silicon (Si) solar cells. Traditionally, screen‐printed silver (Ag) contacts on the front surface have dominated the industry owing to their simplicity, high throughput, and significant electrical benefits. However, the high cost associated with using over 13–20 mg/Wp of Ag can impede the development of truly cost‐effective solar cells. Therefore, there is an urgent need to explore alternative, economically viable metals compatible with silicon substrates. This study reports on the application of a contact stack consisting of Ag, nickel (Ni), and copper (Cu) in Si solar cells. To prevent Schottky contact formation, Ag is implemented as a seed layer, whereas Ni and Cu form the metal bulk layer. The fabricated bi‐layer stack without selective emitter exhibits a maximum efficiency of ~21.5%, a fill factor of 81.5%, and an average contact resistance of 5.88 mΩ·cm2 for a monofacial PERC cell. Microstructure analysis demonstrates that the metals within the contacts remain distinct, and Cu diffusion into the silicon during the firing process is absent. Consequently, printed bi‐layer contacts emerge as a promising alternative to Ag contacts, reducing the Ag consumption to below 2.5 mg/Wp per cell without compromising overall efficiency.

Enhancing Adhesion and Reducing Ohmic Contact through Nickel–Silicon Alloy Seed Layer in Electroplating Ni/Cu/Ag

Advancing nickel seed layer electroplating for enhanced contact and passivation performance in TOPCon solar cells

Implementation of nickel and copper as cost‐effective alternative contacts in silicon solar cells

Copper-Plating Metallization With Alternative Seed Layers for c-Si Solar Cells Embedding Carrier-Selective Passivating Contacts

Zn As the Protective Layer for Cu Electrode in Wafer-Si Solar Cells

Enhancing poly-Si contact through a highly conductive and ultra-thin TiN layer for high-efficiency passivating contact silicon solar cells

Copper–Nickel Alloy Plating to Improve the Contact Resistivity of Metal Grid on Silicon Heterojunction Solar Cells

Insight into the Contact Mechanism of Ag/Al–Si Interface for the Front‐Side Metallization of TOPCon Silicon Solar Cells

Nano‐size Joule‐Heating to Achieve Low‐Ohmic Ag–Si Contact on Boron Emitters of n‐TOPCon Solar Cells

Formation of a Low Ohmic Contact Nickel Silicide Layer on Textured Silicon Wafers Using Electroless Nickel Plating

Laser Ablation and Ni/Cu Plating Approach for Tunnel Oxide Passivated Contacts Solar Cells with Variate Polysilicon Layer Thickness: Gains and Possibilities in Comparison to Screen Printing

Direct Contact Electroplating Sequence Without Initial Seed Layer for Bifacial TOPCon Solar Cell Metallization

Nickel Electroless Plating: Adhesion Analysis for Mono-Type Crystalline Silicon Solar Cells

Review of the Potential of the Ni/Cu Plating Technique for Crystalline Silicon Solar Cells

Investigation of the Ag–Si contact characteristics of boron emitters for n‐TOPCon solar cells metallized by laser‐assisted current‐injection treatment

Enhancement of NiOx/poly‐Si Contact Performance by Insertion of an Ultrathin Metallic Ni Interlayer

Formation of Sn seeds on indium-free TCO for plating metallization of silicon heterojunction solar cells

Improvement of metal-semiconductor contact on silicon micro-structured surface by electroless nickel technique

A Strategy to Optimize Nickel Oxide/Crystalline Silicon Heterocontact of HJT Solar Cells

Alternative Back Contacts for Sb2Se3 Solar Cells

Morphological, Optical and Electrical Analysis of Ag Polymer-Nickel Low Temperature Top Electrode in Silicon Solar Cell for Tandem Application