Abstract:In this paper, we proposed a roadmap of the need for silver reduction in industrial silicon solar cells in the TW era. Several metallization approaches towards an intermediate and long‐term target level of 5 mg/W and 2 mg/W have been systematically discussed. Secondly, we presented a promising hybrid metallization design by combining the advantages of screen‐printing and plating technologies to significantly reduce silver consumption thereby achieving the target value of 5 mg/W for TOPCon and 2 mg/W for PERC solar cells. As PV manufacturing heads towards the multi‐TW scale, it is required to carefully evaluate a wide range of concepts including not only efficiency and cost but also material consumption to ensure sustainable manufacturing of PV technologies. The rapid growth of PV could significantly increase the demand for several materials required in solar cells such as silver, aluminium, copper and even silicon, thereby causing dramatic price fluctuations. Furthermore, the PV manufacturing capacity would be at risk of being limited by the supply of some scarce metals, e.g. with current industrial implementations – screen printing (SP) metallization, the capacities of PERC and TOPCon could be capped at 377 GW and 227 GW with 20% of global silver supply available to the PV industry. In addition, PV systems have ~25–30 years lifespan to ensure low LCOE and emissions. Recycling alone will not provide an immediate solution to overcome the limitation of material consumption in the exponentially growing PV market. It is expected that the Ag usage needs to be reduced to no more than 5 mg/W or even 2 mg/W for all solar cell technologies to allow a multi‐TW manufacturing scale without depleting the global silver supply. Therefore, further advancements in metallization technologies are critically and urgently required to significantly reduce the silver consumption of current screen‐printed contacts in industrial silicon solar cells. This paper firstly presents a roadmap towards the 5 mg/W and 2 mg/W silver consumption targets with various metallization technologies and screen‐printing designs. Subsequently, a hybrid plating on screen‐printed metallization design was proposed to improve the performance and reduce the silver consumption of screen‐printed contacts. The experimental results have demonstrated up to 1.08%abs improvements in fill factor and 0.3%abs gains in cell efficiency. In addition, up to 40%rel reductions in finger silver consumption have been achieved without any sacrifices in the electrical conductivity of such hybrid screen‐printed and plated fingers. This work proposes not only a roadmap but also a promising approach to significantly reduce the Ag demand and benefit sustainable production of industrial screen‐printed silicon solar cells in the TW era.

Implementation of nickel and copper as cost‐effective alternative contacts in silicon solar cells

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Screen-Printable Cu–Ag Core–Shell Nanoparticle Paste for Reduced Silver Usage in Solar Cells: Particle Design, Paste Formulation, and Process Optimization

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Optimized Metallization for Interdigitated Back Contact Silicon Heterojunction Solar Cells

Formation of a Copper Contact Grid on the Surface of Silicon Heterojunction Solar Cells

Fabrication of Metal Grid on Silicon-Based Solar Cell by Electrochemical Deposition and Microcontact Print

Low‐cost metallization based on Ag/Cu fingers for exceeding 25% efficiency in industrial silicon heterojunction solar cells