Abstract:This study introduces a double‐layer metallization strategy using silver as a seed layer with nickel and copper forming the bulk, offering a cost‐effective alternative to traditional silver contacts in silicon solar cells. Demonstrating a substantial reduction in silver usage to below 2.5 mg/Wp, the novel approach promises to significantly lower manufacturing costs without compromising performance. Microstructural analysis and peel force tests confirm the integrity of the contacts, indicating no copper diffusion into the silicon during the firing process. Efficient metal contact formation is pivotal for the production of cost‐effective, high‐performance crystalline silicon (Si) solar cells. Traditionally, screen‐printed silver (Ag) contacts on the front surface have dominated the industry owing to their simplicity, high throughput, and significant electrical benefits. However, the high cost associated with using over 13–20 mg/Wp of Ag can impede the development of truly cost‐effective solar cells. Therefore, there is an urgent need to explore alternative, economically viable metals compatible with silicon substrates. This study reports on the application of a contact stack consisting of Ag, nickel (Ni), and copper (Cu) in Si solar cells. To prevent Schottky contact formation, Ag is implemented as a seed layer, whereas Ni and Cu form the metal bulk layer. The fabricated bi‐layer stack without selective emitter exhibits a maximum efficiency of ~21.5%, a fill factor of 81.5%, and an average contact resistance of 5.88 mΩ·cm2 for a monofacial PERC cell. Microstructure analysis demonstrates that the metals within the contacts remain distinct, and Cu diffusion into the silicon during the firing process is absent. Consequently, printed bi‐layer contacts emerge as a promising alternative to Ag contacts, reducing the Ag consumption to below 2.5 mg/Wp per cell without compromising overall efficiency.

Fabrication of Metal Grid on Silicon-Based Solar Cell by Electrochemical Deposition and Microcontact Print

Formation of Nanostructured Emitter for Silicon Solar Cells Using Catalytic Silver Nanoparticles

Constructing Submicron Textures on Mc-Si Solar Cells Via Copper-Catalyzed Chemical Etching

Formation of a Low Ohmic Contact Nickel Silicide Layer on Textured Silicon Wafers Using Electroless Nickel Plating

Enhancing Adhesion and Reducing Ohmic Contact through Nickel–Silicon Alloy Seed Layer in Electroplating Ni/Cu/Ag

Review of the Potential of the Ni/Cu Plating Technique for Crystalline Silicon Solar Cells

Metal aerosol jet printing for solar cell metallization

Implementation of nickel and copper as cost‐effective alternative contacts in silicon solar cells

Formation of a Copper Contact Grid on the Surface of Silicon Heterojunction Solar Cells

Fabrication and photovoltaic conversion enhancement of graphene/n-Si Schottky barrier solar cells by electrophoretic deposition

Mechanical and Electrical Properties of Ni-Ag Metallized TOPCon Silicon Solar Cells Structured by Green Picosecond Laser

Copper-Plating Metallization With Alternative Seed Layers for c-Si Solar Cells Embedding Carrier-Selective Passivating Contacts

Advancing nickel seed layer electroplating for enhanced contact and passivation performance in TOPCon solar cells

The Modulation of Surface Texture for Single-Crystalline Si Solar Cells Using Calibrated Silver Nanoparticles As a Catalyst

Copper–Nickel Alloy Plating to Improve the Contact Resistivity of Metal Grid on Silicon Heterojunction Solar Cells

Developing Screen-Printing Processes for Silver Electrodes Towards All-Solution Coating Processes for Solar Cells

Direct Contact Electroplating Sequence Without Initial Seed Layer for Bifacial TOPCon Solar Cell Metallization

Integration of Light Trapping Silver Nanostructures in Hydrogenated Microcrystalline Silicon Solar Cells by Transfer Printing

Lithography-free sub-100nm nanocone array antireflection layer for low-cost silicon solar cell

Fabrication of local micro-contacts to silicon solar cells by dewetting of ultrathin polymer films

Fabrication of nanopatterned metal layers on silicon by nanoindentation / nanoscratching and electrodeposition