Abstract:This study introduces a double‐layer metallization strategy using silver as a seed layer with nickel and copper forming the bulk, offering a cost‐effective alternative to traditional silver contacts in silicon solar cells. Demonstrating a substantial reduction in silver usage to below 2.5 mg/Wp, the novel approach promises to significantly lower manufacturing costs without compromising performance. Microstructural analysis and peel force tests confirm the integrity of the contacts, indicating no copper diffusion into the silicon during the firing process. Efficient metal contact formation is pivotal for the production of cost‐effective, high‐performance crystalline silicon (Si) solar cells. Traditionally, screen‐printed silver (Ag) contacts on the front surface have dominated the industry owing to their simplicity, high throughput, and significant electrical benefits. However, the high cost associated with using over 13–20 mg/Wp of Ag can impede the development of truly cost‐effective solar cells. Therefore, there is an urgent need to explore alternative, economically viable metals compatible with silicon substrates. This study reports on the application of a contact stack consisting of Ag, nickel (Ni), and copper (Cu) in Si solar cells. To prevent Schottky contact formation, Ag is implemented as a seed layer, whereas Ni and Cu form the metal bulk layer. The fabricated bi‐layer stack without selective emitter exhibits a maximum efficiency of ~21.5%, a fill factor of 81.5%, and an average contact resistance of 5.88 mΩ·cm2 for a monofacial PERC cell. Microstructure analysis demonstrates that the metals within the contacts remain distinct, and Cu diffusion into the silicon during the firing process is absent. Consequently, printed bi‐layer contacts emerge as a promising alternative to Ag contacts, reducing the Ag consumption to below 2.5 mg/Wp per cell without compromising overall efficiency.

Copper–Nickel Alloy Plating to Improve the Contact Resistivity of Metal Grid on Silicon Heterojunction Solar Cells

Enhancing Adhesion and Reducing Ohmic Contact through Nickel–Silicon Alloy Seed Layer in Electroplating Ni/Cu/Ag

Copper-Plating Metallization With Alternative Seed Layers for c-Si Solar Cells Embedding Carrier-Selective Passivating Contacts

Copper metallization of electrodes for silicon heterojunction solar cells: Process, reliability and challenges

Implementation of nickel and copper as cost‐effective alternative contacts in silicon solar cells

Review of the Potential of the Ni/Cu Plating Technique for Crystalline Silicon Solar Cells

Formation of a Copper Contact Grid on the Surface of Silicon Heterojunction Solar Cells

Improved Electrical Performance of Low-Temperature-Cured Silver Electrode for Silicon Heterojunction Solar Cells

Enhancing Electrical and Physical Contacts of Copper‐Electroplated Silicon Heterojunction Solar Cells Through Chemical Pretreated Seed Layers

Advancing nickel seed layer electroplating for enhanced contact and passivation performance in TOPCon solar cells

Nickel Electroless Plating: Adhesion Analysis for Mono-Type Crystalline Silicon Solar Cells

Process challenges of high-performance silicon heterojunction solar cells with copper electrodes

Electroplated Metallization Method For Crystalline Silicon Solar Cells

Effects of Bath Composition, Current Density and Annealing Conditions on the Properties of the Electrodeposited Ni Seed Layer for Cu Contacts in Si Solar Cells

INFLUENCE OF SILVER PASTE COMPOSITION ON OF SCREEN-PRINTED OHMIC CONTACTS SILICON SOLAR CELLS

Improved contact quality for silver-free silicon heterojunction solar cells by phosphoric acid treatment

Laser‐Sintered Silver Metallization for Silicon Heterojunction Photovoltaic Cells

Low-temperature sintering properties of the screen-printed silver paste for a-Si:H/c-Si heterojunction solar cells

Advanced metallization with low silver consumption for silicon heterojunction solar cells

Fabrication of Metal Grid on Silicon-Based Solar Cell by Electrochemical Deposition and Microcontact Print