INFLUENCE OF SILVER PASTE COMPOSITION ON OF SCREEN-PRINTED OHMIC CONTACTS SILICON SOLAR CELLS

Jianhua Zheng,Yaping Zhang,Yiwei Ao,Tieyu Gong,Lihua Ding,Guorong Chen,Yunxia Yang
DOI: https://doi.org/10.3321/j.issn:0254-0096.2008.10.017
2008-01-01
Abstract:Screen-printing is widely used for low-cost Si solar cells to realize metal/semiconductor contacts, namely ohmic contacts, which is an important factor to improve efficiency and filling factor (FF). The measurement of specific contact resistance is a useful method to evaluate quantitatively the quality of ohmic contact. In the present work, the specific contact resistances were measured by transfer-length method (TLM) in order to study quantitatively the influence of silver particle size and glass constituents on the Ag/Si contact, in which the silver pastes were used to form the front-side grids on Si substrates. The results show that the specific contact resistance decreases with the increased silver particle size and the Pb concentration in glass to form good ohmic contacts.
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