Simultaneous enhancement of strength and conductivity via self-assembled lamellar architecture

Tielong Han,Chao Hou,Zhi Zhao,Zengbao Jiao,Yurong Li,Shuang Jiang,Hao Lu,Haibin Wang,Xuemei Liu,Zuoren Nie,Xiaoyan Song
DOI: https://doi.org/10.1038/s41467-024-46029-w
IF: 16.6
2024-02-29
Nature Communications
Abstract:Abstract Simultaneous improvement of strength and conductivity is urgently demanded but challenging for bimetallic materials. Here we show by creating a self-assembled lamellar (SAL) architecture in W-Cu system, enhancement in strength and electrical conductivity is able to be achieved at the same time. The SAL architecture features alternately stacked Cu layers and W lamellae containing high-density dislocations. This unique layout not only enables predominant stress partitioning in the W phase, but also promotes hetero-deformation induced strengthening. In addition, the SAL architecture possesses strong crack-buffering effect and damage tolerance. Meanwhile, it provides continuous conducting channels for electrons and reduces interface scattering. As a result, a yield strength that doubles the value of the counterpart, an increased electrical conductivity, and a large plasticity were achieved simultaneously in the SAL W-Cu composite. This study proposes a flexible strategy of architecture design and an effective method for manufacturing bimetallic composites with excellent integrated properties.
multidisciplinary sciences
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