Increasing strength and conductivity of Cu alloy through abnormal plastic deformation of an intermetallic compound

Seung Zeon Han,Sung Hwan Lim,Sangshik Kim,Jehyun Lee,Masahiro Goto,Hyung Giun Kim,Byungchan Han,Kwang Ho Kim

DOI: https://doi.org/10.1038/srep30907

IF: 4.6

2016-08-01

Scientific Reports

Abstract:The precipitation strengthening of Cu alloys inevitably accompanies lowering of their electric conductivity and ductility. We produced bulk Cu alloys arrayed with nanofibers of stiff intermetallic compound through a precipitation mechanism using conventional casting and heat treatment processes. We then successfully elongated these arrays of nanofibers in the bulk Cu alloys to 400% of original length without breakage at room temperature using conventional rolling process. By inducing such an one-directional array of nanofibers of intermetallic compound from the uniform distribution of fine precipitates in the bulk Cu alloys, the trade-off between strength and conductivity and between strength and ductility could be significantly reduced. We observed a simultaneous increase in electrical conductivity by 1.3 times and also tensile strength by 1.3 times in this Cu alloy bulk compared to the conventional Cu alloys.

multidisciplinary sciences