Abstract:The Ag-Cu alloys have received attention due to their excellent electrical and mechanical properties. However, the analytical research on why the mechanical properties of the Ag-Cu alloys increase after a small amount of Cu atoms are added is still lacked. In this work, the classical molecular dynamics (MD) simulations method was used to establish the Ag-Cu alloy models with different Cu contents. The tensile deformation mechanism of Ag-Cu alloy at room temperature was revealed from the atomic scale through the analysis of the stress-strain behavior and the evolution of dislocations. During the simulations, the embedded atom method (EAM) potential was used to describe the interaction between Ag atom and Cu atom. The uniaxial tensile deformation and nanostructure evolution of Ag-3 at.% Cu, Ag-6 at.% Cu and Ag-10 at.% Cu alloy models at the temperature of 300 K and the strain rate of 0.02 Å/ps were studied in detail. Results show that the internal stress was generated due to the large lattice mismatch among Ag atom, Cu cluster and the grain boundary. It results in the formation of dislocation and the negative initial stress at the beginning stage of Ag-Cu alloy models under tension. The dislocation firstly nucleates at the grain boundary and the growth rate of dislocation is slow before the crack propagation, and the complex dislocation reactions also exist. With the increase of Cu content, the tensile strengths of Ag-Cu alloys also increase. Cracks mainly form at the intersection of multiple grains, and the fracture mode changes from the intergranular fracture to the intergranular fracture and transgranular fracture after the unstable propagation of cracks. Meanwhile, a plenty of Cu atoms are distributed in the form of clusters in Ag matrix. They hinder the slip of dislocation and slow the relative sliding between atomic layers, and thus finally improves the deformation resistance to the plastic deformation of Ag-Cu alloy. The study on the tensile deformation behavior of Ag-Cu alloy at room temperature has certain guiding significance for the practical production and application of the design of Ag-Cu alloy.

Deformation of Fe and Ag Precipitates in Cu Matrix

Co-deformation in Cu–6 Wt.% Ag Nanocomposites

Achieving Homogeneous Fe Distribution and High Strength in Cu-Fe Composite Consolidated by Powder Rolling

Reforming Nanostructured CuAg Alloy to Improve Ductility and Electrical Conductivity

Microstructure Evolution of Cu/Ag Interface in the Cu–6 Wt.% Ag Filamentary Nanocomposite

Microstructure evolution and properties of Cu–Ag microcomposites with different Ag content

Interface Structure Between Ag Precipitates and Cu Matrix and Its Effect on the Properties of the Cu-Ag Alloy

Microstructure and Properties of Cold Drawing Cu-2.5% Fe-0.2% Cr and Cu-6% Fe Alloys

Strengthening Effect of Ag Precipitates in Cu–Ag Alloys: A Quantitative Approach

Tensile strength and Young's modulus of Cu-Ag alloys in the evolution of microstructure into filamentary composites

Morphology Evolution of Two-Phase Cu-Ag Alloys under Different Conditions

Strain Compatibility Behavior in Cu-6%Ag Alloy During Drawing into Filamentary Structure

Atomistic Simulation of Interactions Between an Edge Dislocation and Cu Precipitates with Different Chemical Compositions in Α-Fe

Molecular Dynamics Simulation Research on Fe Atom Precipitation Behaviour of Cu-Fe Alloys during the Rapid Solidification Processes

Evolution of Precipitate and Precipitate/matrix Interface in Al-Zn-Mg-Cu(-Ag)alloys

Microstructure and Properties of Heavily Drawn Cu-Ag-Fe Composites

Effect of Accelerated Fe-Rich Precipitation Induced by Ag Addition on the Microstructure and Comprehensive Properties of Cu–10 Wt Pct Fe Alloys

The tensile behaviors of Ag-Cu alloys with different Cu contents: Molecular dynamics simulations study

Dissolution behavior of nano-sized precipitates in aged Al-Si-Mg-Cu alloy during cold deformation

Microstructure and properties of Cu-50Fe alloy produced by chemical co-precipitation and powder metallurgy

Cold deformation behavior and microstructure evolution of biomedical Cu-containing L605 alloy