Excellent Mechanical Properties and High Electrical Conductivity of Cu-Co-Si-Ti Alloy Due to Multiple Strengthening

Yongfeng Geng,Yijie Ban,Xu Li,Yi Zhang,Kexing Song,Yanlin Jia,Baohong Tian,Meng Zhou,Yong Liu,Alex A. Volinsky
DOI: https://doi.org/10.2139/ssrn.3782845
2021-01-01
SSRN Electronic Journal
Abstract:High performance copper alloys are widely used in electrical, electronic, aerospace fields welcomed due to their high electrical conductivity and excellent mechanical properties. At present work, we proposed a new class of Cu-Co-Si-Ti alloy by incorporating the multiple alloying elements, resulting in the multiple strengthening during heat treatment. The achievement of solution strengthening, deformation strengthening and dual-nanoprecipitation strengthening leaded to the Cu-Co-Si-Ti alloy with excellent tensile strength (617.9 MPa) and high electrical conductivity (41.7% IACS) by the optimum process of 50% cold rolling and aging at 500 °C for 30 min. EBSD was used to analyze the microstructure and texture evolution during the aging process. Moreover, it was found that the volume fraction of Goss, Brass, copper and S texture had close connections with the mechanical properties. By comparing with the contributions of multiple strengthening mechanisms, dual-nanoprecipitation strengthening contributed quite a lot due to the nanoprecipitation of Co2Si and Cu4Ti.
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