Impact of Post-deposition Plasma Treatment on Surface Passivation Quality of Silicon Nitride Films

Sandeep S. Saseendran,Mehul C. Raval,Anil Kottantharayil
DOI: https://doi.org/10.1109/jphotov.2015.2493369
2016-01-01
IEEE Journal of Photovoltaics
Abstract:Exposing a plasma-enhanced chemical vapor deposition-deposited silicon nitride (SiNx) film to an inert gasoxidizing plasma ambient results in a significant reduction in background plating in the case of electroplated Ni-Cu metallization on c-Si solar cells. However, plasma treatment of SiNx is known to result in a degradation of the Si-SiNx interface. In this paper, we investigate the impact of an Ar/N2 O plasma treatment process on the surface passivation properties of SiNx film. Following the plasma treatment, effective minority carrier lifetime (τeff ) is seen to improve from 266 to 864 μs at a minority carrier density of 1015 cm-3. The interface-state density (Dit) at the Si-SiNx interface also decreases by an order of magnitude, following the Ar/N2 O plasma treatment. Enhancement in τeff is found to be stable for annealing temperatures up to 450°C, which is typically used for Ni-Cu contact sintering. Substrate annealing during the post-deposition plasma treatment process is seen to play a major role in improving the τeff . Coupled with its potential for reducing the background plating, the proposed process is a promising candidate for developing the passivation layers for cell technologies with low-temperature metallization schemes.
energy & fuels,materials science, multidisciplinary,physics, applied
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