Study on Ag-CuO Sealing Materials for Planer SOFC

Naiqing Zhang
2011-01-01
Journal of Functional Biomaterials
Abstract:Ag-CuO sealing material was used to realize the sealing between the SUS430 interconnect and the NiO-YSZ anode in air.Leakage rate were tested,and SEM and EPMA tests were conducted to determine its hermeticity,compatability and thermal cycling stability.Results indicated that Ag-CuO sealing material could realize the seals between the interconnect and the anode effectively,and when the Cu content was 6mol%,the simulating leakage was smallest,and lower than 0.001mL/(min·cm).After ten times thermal cycling,the leakage rate kept stable.EPMA analyses proved that no element diffusion occured at the interconnect/Ag-CuO interface.
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