Abstract:NiSi-NiCr thin film thermocouples (TFTCs) have significant application value as contact temperature sensors in cutting temperature measurements owing to their fast response and negligible volume. However, due to the relatively high chemical activity of Ni-based alloys, high-temperature oxidation strongly affects the operational reliability of NiSi-NiCr TFTCs. In this respect, depositing an anti-oxidation coating onto the surface of NiSi-NiCr TFTCs is considered an effective way to protect them in high-temperature environments. In this study, NiSi and NiCr films were deposited on cemented carbides and annealed at 200 °C-600 °C in air. Scanning electron microscope, X-ray diffraction spectroscopy, X-ray photoelectron spectroscopy, and four-probe resistivity tests were used to characterize the microstructure and resistivity of NiSi and NiCr film. Then SiNxOy films were deposited onto the NiSi and NiCr films and compared with uncoated samples after annealing at 600 °C. The effect of SiNxOy films on the thermal stability and thermoelectric output of NiSi-NiCr TFTCs was investigated. The results show that the NiSi film was partially oxidized at 200 °C and entirely oxidized when the temperature exceeded 400 °C. The completely oxidized NiSi films had evident defects and cracks, and the resistivity increased by a factor of over 1000. The NiCr film could not be completely oxidized at 600 °C, which is attributed to the formation of Cr2O3 as an external oxide barrier layer. Below 600 °C, SiNxOy films could effectively protect NiSi and NiCr films from oxidation. Thus, the addition of SiNxOy film increases the maximum temperature at which NiSi-NiCr TFTCs can be used.

Crystallization and Oxidation Behaviors of Cr-Si-Ni-N Resistive Films

Effect of Nitrogen on Crystallization Behavior and Electrical Properties of Cr-Si-Al Resistive Films

Microstructure and Electrical Resistivity of Cr-Si-Ni Films Deposited on Si Substrates

The Role of Aluminum in the Crystallization of Cr–Si–Ni Resistive Films

Microstructure and Electrical Characteristics of Cr–Si–Ni Films Deposited on Glass and Si (100) Substrates by RF Magnetron Sputtering

The Crystallization of Cr–Si–Ni–Al Amorphous Films—nucleation and Growth of Intermetallic Phase Cr(Al,Si)2

Electrical Stability of Cr-Si-Ni Resistive Films in Acidic and Alkaline Aqueous Solutions

Research on the Resistivity and Infrared Emissivity of Nonstoichiometric TiCrN Films

Effects of silicon content on the structure and mechanical properties of (AlCrTaTiZr)–Si<sub><i>x</i></sub>–N coatings by reactive RF magnetron sputtering

Oxidation Behaviour of NiSi-NiCr Thin Film Thermocouples and Antioxidation Effect of SiNxOy Film

Comparison of NiCr-O and Cr-Si Thin Film Resistors with Mid-Range of Electric Resistance

Effects of silicon content on the structure and mechanical properties of (AlCrTaTiZr)–Six–N coatings by reactive RF magnetron sputtering

Evolutions of the Microstructure and Properties of the (CrMoNbTaZr)NX Films Prepared by Reactive Magnetron Sputtering: Effects of Stoichiometry and Crystallinity

Effects of Nitrogen Content on the Structure and Mechanical Properties of (Al0.5CrFeNiTi0.25)Nx High-Entropy Films by Reactive Sputtering

Study on Microstructure and Properties of Zr-Si-N Films with Different Nitrogen Partial Pressures

Corrosion Behavior of Sputtered Cr–Si–Ni Resistive Films in Acidic and Alkaline Environments

Nitride Films Deposited from an Equimolar Al–Cr–Mo–Si–Ti Alloy Target by Reactive Direct Current Magnetron Sputtering

Influence of Nitrogen Content on the Microstructure Evolution and Oxidation Resistance toward Ambient Air of CrAlSiN Coatings Deposited by FCVAD Technique

Structural, surface electronic bonding, optical, and mechanical features of sputtering deposited CrNiN coatings with Si and Al additives

Structure, Composition and Mechanical Properties of Reactively Sputtered (tivcrtaw)nx High-Entropy Films

Controlling the Superconducting Critical Temperature and Resistance of NbN Films through Thin Film Deposition and Annealing