Determination of Failure Degree of 1.2 Kv SiC MOSFETs after Short-Circuit Test Using an Improved Test Setup

Shen Diao,Jun Sun,Ziwei Zhou,Zhenzhong Zhang,Adolf Schoner,Zedong Zheng,Weiwei He
DOI: https://doi.org/10.1016/j.npe.2020.12.002
2020-01-01
Abstract:Analysis of the short-circuit characteristics of SiC metal-oxide-semiconductor field-effect transistors (MOSFETs) is very important for their practical application. This paper studies the SiC MOSFET short-circuit characteristics with an improved test setup under different conditions. A high-current Si insulated gate bipolar transistor is used as a circuit breaker in the test circuit rather than the usual short-circuit test conducted without a circuit breaker. The test platform with a circuit breaker does not influence the calculation results regarding the short-circuit withstand time and energy, but the SiC MOSFET will switch off after failure in a very short time. In addition, the degree of failure will be limited and confined to a small area, such that the damage to the chip will be clearly observable, which is significant for short-circuit failure analysis.
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