Abstract:<p class="Para">Numerical and experimental analysis of high-aspect-ratio micro-tool electrodes fabrication using a controlled electrochemical machining (ECM) technique is reported. The evolution of the tool electrode shape was first predicted using a finite element method-based numerical simulation and then validated with the detailed experiments. The effects of machining voltages and the machining durations on the change in the tool electrode profile were investigated. High-carbon steel was chosen as an electrode material due to its lower cost, good electrical conductivity, and easy availability. A 5% (i.e., 5 gm of NaCl in 100 ml of deionized water) NaCl solution was used as the electrolyte. The tool profiles predicted using the FEM-based numerical model showed an excellent matching trend with the ECM experimental results. The role of the black surface film formed on the electrode surface was found to be significant. The tool electrodes having an average diameter of 60 µm and an aspect ratio of more than 75 were fabricated at the optimized machining parameters. These single-tip micro-tool electrodes were used to create through-hole in a 400-µm-thick glass substrate by electrochemical discharge machining. The obtained ECM process parameters were used to create multiple electrodes having a tip size of 130 µm and having a smooth surface. These through-holes were filled with copper to form 3D interconnects, i.e., through-glass vias, which are required in the radio-frequency MEMS applications and 3D packaging.</p><h3 class="Heading">Graphic abstract</h3> <a href="https://media.springernature.com/original/springer-static/image/art%3A10.1007%2Fs10800-019-01380-5/MediaObjects/10800_2019_1380_Figa_HTML.png"><span class="u-screenreader-only">Open image in new window</span></a>

FEM Simulation of the Uniformity of the Thickness of the MEMS Microstructure Electrodeposition

Modeling and Simulation of Electrostatic Micropump Based on MEMS

Effect of the Thickness Uniformity in Micro-Electroforming Process by Dividing Conductive Zone on Cathode

Meniscus-confined Electrodeposition of Metallic Microstructures with In-Process Monitoring of Surface Qualities

Uniformity Control of Ni Thin-Film Microstructures Deposited by Through-Mask Plating

Numerical simulation of nickel electroforming process influenced by flow field

The Physical Improvement of Copper Deposition Uniformity with the Simulation Models

MOEMS 3D microstructure preparation method based on novel localized electrochemical deposition

Defects in Micro Hot Embossing Process

Demolding Defects and the Design of Demolding Device in Micro Hot Embossing Process

A Novel Approach to Study Patterned Thin Film Local Stress for Microelectronics Application

Simulation and Experimental Study on Metal Microstructure of Meniscus‐Confined Electrodeposition

Study of wetters in nickel electroforming of 3D microstructures

Simulation and Optimization on the Uniformity of the Electroplating film

Etching uniformity study of mask electrolyte jet machining based on mass transfer coefficient: 3D simulation and experimental validation

Electrochemical Deposition of Pure-Nickel Microstructures with Controllable Size

Simulation methods for micro-electro-mechanical structures (MEMS) with application to a microtweezer

The Multi-Physics Analysis for a Novel Tool Structure to Improve the Accuracy in Electrochemical Micro-Machining

Numerical analysis of electrodeposition in microcavities

Numerical and experimental analysis of high-aspect-ratio micro-tool electrode fabrication using controlled electrochemical machining

Research On Micro Electrode Fabrication Based On Ecm