Abstract:Recently, Ni electroforming is playing an indispensable role in modern optical manufacturing, and multilayer molybdenum/silicon (Mo/Si) film is a promising reflective material with potential applications in soft X–ray/EUV microscopy and astrophysical research. Therefore, the multilayer Mo/Si mirrors (MLMs) fabricated by Ni electroforming is highly expected, where the electrochemical process and deposition quality need to be clarified firstly. In this study, the temperature impacts on the electrochemical reaction dynamics and nucleation mechanisms of Ni electrodepositions on multilayer Mo/Si and monolayer Pt films were compared, and the variations in crystallization growth and microhardness were further discussed. The results showed that the apparent activation energy of Ni electrodepositions on Mo/Si and Pt films was 24.36 kJ/mol and 17.69 kJ/mol, respectively, while the increase in temperature had the similar depolarization influence on both films by positively shifting the reduction potential. In the meanwhile, the 3D instantaneous mechanism remained as the initial nucleation mode for Ni electrodepositions on multilayer Mo/Si film, while as temperature rose, the grain growth gradually changed from a highly coarse and large–sized pyramidal structure to a more refined cluster mode. Nevertheless, the grain texture for Ni electrodepositions on monolayer Pt film evolved from a regularly cone shape to an unevenly elliptical colony–like morphology, primarily ascribed to the progressive nucleation procedure along with higher hydrogen evolution at elevated temperature. Consequently, the appropriate increase in deposition temperature effectively encouraged the rapid development of particular crystal planes and modified the microscopic quality of microhardness, which provided a reference for optimizing fabrication of metallic mirror based on Ni electroforming.

Uniformity Control of Ni Thin-Film Microstructures Deposited by Through-Mask Plating

Effect of the Thickness Uniformity in Micro-Electroforming Process by Dividing Conductive Zone on Cathode

Effects of Process Conditions on Properties of Electroplated Ni Thin Films for Microsystem Applications

Influencing Factors on the Uniformity of Electroless Nickel Plating on Cenospheres

Influencing factors on the uniformity of copper coated nano-Al2O3 powders prepared by electroless plating

Meniscus-confined Electrodeposition of Metallic Microstructures with In-Process Monitoring of Surface Qualities

Numerical simulation of optimizing plating uniformity of gold plating

Electrodeposition and Characterization of Nano-Structured Black Nickel Thin Films

Electrochemical study and structural comparison of Ni electrodepositions on W/Si and Cr/C multilayered structure films

Thickness uniformity, electrical properties, and stress of sputtered TiN thin films

Large-area homogeneous corrosion process for electrochemical nanoimprint lithography on GaAs wafer by modulating contact pressure

Processing and Characterization of Precision Microparts from Nickel-based Materials

Comparing the electrochemical mechanisms and microhardness of Ni electrodepositions on multilayer Mo/Si and monolayer Pt films at different temperatures

Preparation and Characterization of Ni-Coated Cr3c2 Powder by Room Temperature Ultrasonic-Assisted Electroless Plating

Near-substrate composition depth profile of direct current-plated and pulse-plated Fe-Ni alloys

23‐2: Invited Paper: Fabrication of Super Uniform Nickel Bumps Using Electroless Plating on Micro‐LEDs’ TFT Driver Substrates

High-Throughput Combinatorial Analysis of the Spatiotemporal Dynamics of Nanoscale Lithium Metal Plating

Uncertainty analysis of factors affecting coating thickness distribution during nickel electrodeposition

Initial surface roughness of electrochemical plating copper under different conditions

Microscale shaping and rounding of ridge arrays and star pattern features on nickel mould via electrochemical polishing

Droplet-confined electroplating for nanoscale additive manufacturing: current control of the initial stages of the growth of copper nanowires