Abstract:The current research was focused on the mechanism and kinetics of Cobalt, Iron, and their alloy: cobalt ferrite electrodeposition from its dissolved ions in a eutectic mixture called Reline (formed by choline chloride and urea), an ionic liquid non-toxic and biodegradable, varying the hydrodynamic conditions, which had not been reported previously from non-aqueous solvents. This kind of alloy has been widely studied, mainly for its hard-magnetic properties that have improved very large amounts of components like information storage systems. Reline is part of the ionic liquids known as deep eutectic solvents (DES) with low vapor pressure, a wide potential range, a high electrical and thermal conductivity, lower cost, and greater stability. Cobalt, Iron, and cobalt ferrite nanoparticles, CoFeNPs, were electrodeposited onto a glassy carbon electrode (GCE), from a DES formed by choline chloride and urea (Reline) in a 1:2 molar ratio containing 50 mM cobalt chloride, CoCl2, and 50 mM iron chloride, FeCl3, at 70 °C. Cyclic voltammetry was used to study the convection effect on the electrodeposition from DES and ascertain the electrodeposition potential range of redox reactions. The chronoamperometric results led to determining the mechanism involved during these electrochemical phase formation processes and the kinetic parameters, such as: the number density of active sites (N0), nucleation rate (A), water reduction constant rate (kwr) and diffusion layer thickness (δ), as a function of the electrode angular speed and electrodeposition potential. These kinetic parameters were obtained from non-linear to the experimental potentiostatic current transients using the Hyde and Compton theoretical equation [1] for Co, Fe and Co-Fe systems under forced convection. The alloyed Fe-Co electrodeposits without agitation were analyzed by the model of Díaz-Morales et al. [2]. On the other hand, the Fe and Co deposits were studied with Heerman and Tarallo model [3]; complemented with M. Palomar – Pardavé et al. model [4] for concomitant reactions. The dominant mechanism of the electrodeposition processes for the three systems was the multiple nucleation with diffusion-limited 3D growth It was found that A increased with the applied potential and that the diffusion layer thickness increased with decreasing angular speed. Water reduction was recognized as concomitant processes in the systems without agitation for the highest applied potentials which were catalyzed mainly by Co deposits. The electrodeposits were characterized by X-rays Energy Dispersive Spectroscopy (EDX) - Scanning Electron Microscopy (SEM) and X-Ray photoelectron spectrometry (XPS) revealed the presence of Co-Fe oxides with spherical morphology, cobalt hydroxide, and metallic cobalt.

Near-substrate composition depth profile of direct current-plated and pulse-plated Fe-Ni alloys

Preparation of thin solid CoNiFe films by pulse-reverse electroplating technique

Codeposition Behavior of Fe-Ni Alloys: A Review in Mechanisms, Preparation and Effects on Composition

Electroless Ni-Fe Alloy Depositions Using DMAB and NaPH2O2 as a Reducing Agent

Influencia de la convección forzada sobre la cinética de electrodeposición de Fe, Co, y Fe-Co en el disolvente eutéctico profundo Cloruro de Colina-Urea

Effect of Pulse Electrodeposition Mode on Microstructures and Properties of Ni-TiN Composite Coatings

Study of the Effect of Current Density on the Metallurgical Properties of AlFeCrNiTi High Entropy Alloy Coating Produced by Pulse Plating

Electrodeposition and corrosion performance of Ni-Co alloys with different cobalt contents

Electrochemical Behavior of Nanostructured Fe-Pd Alloy During Electrodeposition on Different Substrates

Microstructure and Properties of Electrodeposited Nanocrystalline Ni-Co-Fe Coatings

Evaluation of corrosion resistance of electrodeposited nanocrystalline Ni–Fe alloy coatings

Process for Nickel-Phosphorous Pulse Electroplating and Corrosion Resistance of the Alloy Coating

Electrodeposition of Ni–Co alloys from a deep eutectic solvent

Electrodeposition Behavior of Nanocrystalline Conife Soft Magnetic Thin Film

Investigation on the effect of nickel and nickel-chromium alloy pulse current plating on copper substrate

Corrosion Studies on Pulse Reverse Ni-Mo Coatings Electrodeposited on Cu Substrate

Synthesis and Evaluation of Pulse Current and Direct Current Electroplating Ni-W Coatings on Steel

Study on the Behavior of Zn–Fe Alloy Electroplating

Electrodeposited NiFe films for electronic applications: structure and magnetic properties

Reverse depth profiling of electrodeposited Co/Cu multilayers by SNMS

Effects of Direct and Pulse Plating on the Co-Deposition of Sn–Ni/TiO2 Composite Coatings