Electrodeposition Behavior of Nanocrystalline Conife Soft Magnetic Thin Film

Li Jing-Feng,Zhang Zhao,Yin Jun-Ying,Yu Geng-Hua,Cai Chao,Zhang Jian-Qing
DOI: https://doi.org/10.1016/s1003-6326(06)60117-9
IF: 3.752
2006-01-01
Transactions of Nonferrous Metals Society of China
Abstract:The electroplating behavior of nanocrystalline CoNiFe soft magnetic thin film with high saturation magnetic flux density (B-s > 2.1 T) and low coercivity (H-c) was investigated using cyclic voltammetry and chronoamperometry methods in conjunction with the scanning electron microscopy (SEM/EDX). The results show that, under the experimental conditions, the co-deposition of CoNiFe film behaves anomalously due to the atomic radii of iron series elements following the order of r(Fe) > r(Co) > r(Ni). In the case of lower electroplating current density, the co-deposition of CoNiFe film follows a 3-D progressive nucleation/growth mechanism, while in the case of higher electroplating current density, which follows a 3-D instantaneous nucleation/growth mechanism. Meanwhile, the change of nucleation mechanism of CoNiFe film with electroplating current density was interpreted theoretically in the light of quantum chemistry.
What problem does this paper attempt to address?