Abstract:Microscale metallic structures enhanced by additive manufacturing technology have attracted extensive attention especially in microelectronics and electromechanical devices. Meniscus-confined electrodeposition (MCED) advances microscale 3D metal printing, enabling simpler fabrication of superior metallic microstructures in air without complex equipment or post-processing. However, accurately predicting growth rates with current MCED techniques remains challenging, essential for achieving precise structure fabrication and preventing nozzle clogging. In this work, we present a novel approach to electrochemical 3D printing that utilizes a self-adjusting, voxelated method for fabricating metallic microstructures. Diverging from conventional voxelated printing which focuses on monitoring voxel thickness for structure control, this technique adopts a holistic strategy. It ensures each voxel's position is in alignment with the final structure by synchronizing the micropipette's trajectory during deposition with the intended design, thus facilitating self-regulation of voxel position and reducing errors associated with environmental fluctuations in deposition parameters. The method's ability to print micropillars with various tilt angles, high density, and helical arrays demonstrates its refined control over the deposition process. Transmission electron microscopy (TEM) analysis reveals that the deposited structures, fabricated through layer-by-layer (voxel) printing, contain nanotwins, which are widely known to enhance material mechanical and electrical properties. Correspondingly, in situ scanning electron microscopy (SEM) microcompression tests confirm this enhancement, showing these structures exhibit a compressive yield strength exceeding 1 GPa. The indentation tests provided an average hardness of 3.71 GPa, which is the highest value reported in previous work using MCED. The resistivity measured by the four-point probe method was 1.95±0.01×10 -7 Ω·m, nearly 11 times that of bulk copper. These findings demonstrate the considerable advantage of this technique in fabricating complex metallic microstructures with enhanced mechanical properties, suitable for advanced applications in microsensors, microelectronics, and micro-electromechanical systems.

Meniscus-confined Electrodeposition of Metallic Microstructures with In-Process Monitoring of Surface Qualities

A Method for Micropipette-Based Meniscus-Confined Electrodeposition of Microstructures Without Nozzle Clogging

Voxelated Meniscus-Confined Electrodeposition of 3D Metallic Microstructures

3D Printing of Multi-Metallic Microstructures by Meniscus-Confined Electrodeposition.

Simulation and Experimental Study on Metal Microstructure of Meniscus‐Confined Electrodeposition

MOEMS 3D microstructure preparation method based on novel localized electrochemical deposition

Continuous and Stable Printing Method of Planar Microstructure Based on Meniscus-Confined Electrodeposition

Prediction of Deposition Rate in Meniscus‐Confined Electrodeposition Based on Parameter Optimization Algorithm

Microdeposition of 3D Structure on F Ilm Surface Using Micropipette

RETRACTED: 3D Printing of Multi-Metallic Microstructures by Meniscus-Confined Electrodeposition (retracted Article. See Vol. 94, 2023)

A Closed-Loop Constant Deposition Current Control Method Based on MCED Circuit Model

Study of Microscale Meniscus Confined Electrodeposition Based on COMSOL

Site-controlled Preparation of Metallic Microstructures via Mechanical Scratch-induced Selective Electrodeposition

Microscale Structure Additive Manufacturing Control Method Using Localized Electrochemical Deposition

Fabrication of Shape‐Controlled Copper Line Arrays by Meniscus‐Confined 3D Microprinting on Insulating Substrates

A flow-rate-controlled double-nozzles approach for electrochemical additive manufacturing

Self-adjusting voxelated electrochemical three-dimensional printing of metallic microstructures

Fabrication of a Novel Liquid Metal Microelectrode in Microfluidic Chip

Droplet-confined electroplating for nanoscale additive manufacturing: current control of the initial stages of the growth of copper nanowires

Non-Cyanide Thick Silver Electrodeposition Base on Instantaneous Nucleation for 3D Microstructures with High Performance

The Roles of Microprobe in Localized Electrodeposition: Electrolyte Localized Transport and Force-Displacement Sensitivity