Abstract:With the rapid advancement of display and smart lighting technologies, micro-light-emitting diodes (Micro-LEDs) have garnered substantial attention due to their exceptional performance characteristics. However, a significant challenge persists in achieving reliable interconnections between Micro-LED chips and driver backplanes. This article proposes and implements the Double-Layer Photoresist Structure Electroplating (DPSE) technique for fabricating Cu-SnAg metal bumps, thereby facilitating the heterogeneous integration of oxide thin film transistors (TFTs) with GaN-based blue LEDs. The DPSE process was optimized by addressing several critical factors, including the correlation between bump height and electroplating time, the occurrence of cracks in the photoresist surface, and the removal of the conductive layer. Metal bumps were successfully fabricated on TFT backplanes with dimensions of 16.5 μm × 10 μm, an average height of 5.39 μm, and a uniformity of approximately 2.266%. To demonstrate the efficacy of this approach, a 0.495-inch blue active-matrix Micro-LED display was designed and fabricated. This display features a mesa size of 15µm × 30µm, a pixel pitch of 222µm, and a pixel density of 114 pixels per inch (PPI). The resultant blue Micro-LED display exhibits excellent optical characteristics, achieving a brightness of 1625cd/m² (nits). It is anticipated that the methodology and findings presented in this study will contribute significantly to the advancement of Micro-LED display technology in consumer electronics. This research not only represents a significant advancement in the field of Micro-LED display technology, but also paves the way for future innovations in high-resolution, energy-efficient display systems.

23‐2: Invited Paper: Fabrication of Super Uniform Nickel Bumps Using Electroless Plating on Micro‐LEDs’ TFT Driver Substrates

Electroless Deposition of Nickel Microbumps for Fine-Pith Flip-Chip Bonding

Electroless deposition of high-uniformity nickel microbumps with ultrahigh resolution of 8 μm pitch for monolithic Micro-LED display

Electroplating of Cu/Sn bumps with ultrafine pitch and high uniformity for micro-LED interconnection

Fabrication and Mechanical Properties Improvement of Micro Bumps for High-Resolution Micro-LED Display Application

Electroless Deposition of 4 μm High Ni/Au Bumps for 8 μm Pitch Interconnection

Active-matrix TFT Driven GaN Blue Micro-LED Display Realized with Electroplated Copper-Tin-silver Micro Bumps-Based Bonding Structure

Fabrication and Reflow of Indium Bumps for Active-Matrix Micro-LED Display of 3175 PPI

23‐3: Application of Laser‐Assisted Bonding in Micro‐LED display technology

Printing and in Situ Assembly of CdSe/CdS Nanoplatelets As Uniform Films with Unity In-Plane Transition Dipole Moment

Fabrication of Fine-Pitch Cu-Sn Microbumps Using Electroplating and Wet Seed Layer Etching

Seed Layer Etching, Thermal Reflow and Bonding of Cu-Sn Micro Bumps with 5 Μm Diameters

Micro-Cantilever Array With Electroplating Tin Bumps for Flip-Chip Bonding Technology

Efficiency analysis of electroplating gold bump in assembly

A Study on Improvement and Extension of Fine-Pitch Micro-Bump Interconnects Technology: New Metallurgy & Flux-Less Oxide-removal Laser Assembly (FLOLA)

Application of metal interconnection process with micro-LED display by laser-assisted bonding technology

Investigating the Performance and Reliability of Au-Sn Bonded Flip-Chip Micro-LEDs

Fabrication of Ni Microbumps With Small Feature Size on Au Using Electroless Ni Plating With Noncontact Induction

Thermodynamic simulation and analysis of metal bumps in flip-chip micro-LED packaging

Highly Effective Transfer of Micro-LED Pixels to Intermediate and Rigid Substrate with Weak and Tunable Adhesion by Thiol Modification

Process optimization of preparing CMOS backplane for ultrahigh pixel density red Micro-LED display