Micro-Cantilever Array With Electroplating Tin Bumps for Flip-Chip Bonding Technology

C. Tsou,Chengshiun Liou,Zihsong Hu

DOI: https://doi.org/10.1109/TCPMT.2023.3339767

2023-12-01

Abstract:A Nickel (Ni) microcantilever beam array with tin (Sn) solder bumps has been designed for flip-chip bonding with high-density electrodes. Micro-electro-mechanical system (MEMS) technology and the micro-electroplating process were used in the fabrication process. Utilizing the out-of-plane deformation of the suspended microcantilever beam, the satisfied heights partially compensate the substrate curvature to ensure a high flip-chip bonding yield, thus, improving package quality in terms of electrical connections. To demonstrate this technique, this study developed a flip-chip carrier for a typical micro-LED array with a beam length of <inline-formula> <tex-math notation="LaTeX">$70~\mu \text{m}$ </tex-math></inline-formula> and a bump height of <inline-formula> <tex-math notation="LaTeX">$2~\mu \text{m}$ </tex-math></inline-formula>. The measurement results revealed that the displacement of the microcantilever beam was approximately <inline-formula> <tex-math notation="LaTeX">$0.8~\mu \text{m}$ </tex-math></inline-formula> when a <inline-formula> <tex-math notation="LaTeX">$500~\mu \text{N}$ </tex-math></inline-formula> force was applied on top of the tin bump. When a glass substrate directly mounts to the flip-chip carrier through the tin bump at a heat reflow of 270 °C, most of the tin bumps successfully melt and solidify, which results in good bonding performance. These results revealed that the proposed approach could be applied to the wafer-level packaging process with high-density ball grid array electrodes.

Engineering,Materials Science