Abstract:Micro LED display technology has been spotlighted as the most promising technology compared to LCD and OLED. Its excellent advantages include higher brightness, self-illumination, higher resolution, lower power consumption, faster response, higher integration, higher stability, thinner thickness, longer life, etc. In terms of the unique benefits, it is attracting increasing attention from industries. With the commercialization of Micro LED technology, the following hurdles are identified: wafer manufacturing, full color, bonding, and mass transfer. Among them, mass transfer is so far considered as the most severe bottleneck. Several mass transfer technologies have emerged, including fine picking and placing, roll printing, laser transferring, and fluid self-assembly, which aim to solve the mass transfer problems. However, the aforementioned first 3 types of technologies still rely on the pick-and-place process, which is limited when the Micro LED die dimension shrinks to smaller scales due to processability and equipment precision. Fluidity self-assembly, on the other hand, will not be constrained by the Micro LED size and machine accuracy in the mass transfer process, which received increasing attention from researchers. In the self-assembly of component level, gravitational attraction, magnetic /electromagnetic fields, and capillary force are considered the mainstream force to facilitate the assembly process. Therefore, the component self-assembly becomes a prospective substitute for the Micro LED mass transfer solution, which overcomes the problems of the trade-off between throughput and the placement accuracy of the pick-and-place technology.

23‐3: Application of Laser‐Assisted Bonding in Micro‐LED display technology

Application of metal interconnection process with micro-LED display by laser-assisted bonding technology

The improvement of bonding metal layers for high resolution micro-LED display application

High-yield Micro-LED laser transfer accomplished using an ablation-type release material

Investigating the Performance and Reliability of Au-Sn Bonded Flip-Chip Micro-LEDs

Development of Metal Bonding for Passive Matrix Micro-LED Display Applications

Mass transfer for Micro-LED display: Transfer printing techniques

Super retina TFT based full color microLED display via laser mass transfer

Mass transfer, detection and repair technologies in micro-LED displays

P‐85: Development of High‐yield Laser Lift‐off Process for Micro LED Display

P‐6.2: A Study on Micro‐LED Selective Repair Technology for Mass Production Purpose

Metallic Bonding Technique and Applications to Optoelectronic Devices

24.1: Invited Paper: Micro‐LED 4.78 inch Tiled Display Modules with 100% Yield Achieved by Stamp Transfer Technology

Low Temperature Au-In-Au Metallic Bonding and Its Application in the Fabrication of Vcsels

Bonding Process for Micro-LEDs on Polyimide Sacrificial Layer Supporting Laser-Induced Mass Transfer

Electroless deposition of high-uniformity nickel microbumps with ultrahigh resolution of 8 μm pitch for monolithic Micro-LED display

An Alternative Micro LED Mass Transfer Technology: Self-Assembly

P‐161: Full‐in‐situ Imaging and Laser Processing System Supporting Detection and Removal of Defective Micro‐LED Dies During Mass Transfer

Polymer Reinforced Solder Paste for Improving Impact Energy Absorption Capability in Micro LED Laser-Assisted Mass Transfer

Process optimization of preparing CMOS backplane for ultrahigh pixel density red Micro-LED display

Challenges of high-yield manufacture in micro-light-emitting diodes displays: chip fabrication, mass transfer, and detection