Abstract:Micro LED display technology has been spotlighted as the most promising technology compared to LCD and OLED. Its excellent advantages include higher brightness, self-illumination, higher resolution, lower power consumption, faster response, higher integration, higher stability, thinner thickness, longer life, etc. In terms of the unique benefits, it is attracting increasing attention from industries. With the commercialization of Micro LED technology, the following hurdles are identified: wafer manufacturing, full color, bonding, and mass transfer. Among them, mass transfer is so far considered as the most severe bottleneck. Several mass transfer technologies have emerged, including fine picking and placing, roll printing, laser transferring, and fluid self-assembly, which aim to solve the mass transfer problems. However, the aforementioned first 3 types of technologies still rely on the pick-and-place process, which is limited when the Micro LED die dimension shrinks to smaller scales due to processability and equipment precision. Fluidity self-assembly, on the other hand, will not be constrained by the Micro LED size and machine accuracy in the mass transfer process, which received increasing attention from researchers. In the self-assembly of component level, gravitational attraction, magnetic /electromagnetic fields, and capillary force are considered the mainstream force to facilitate the assembly process. Therefore, the component self-assembly becomes a prospective substitute for the Micro LED mass transfer solution, which overcomes the problems of the trade-off between throughput and the placement accuracy of the pick-and-place technology.

P‐6.2: A Study on Micro‐LED Selective Repair Technology for Mass Production Purpose

Mass transfer, detection and repair technologies in micro-LED displays

Efficient Mini/Micro-Perovskite Light-Emitting Diodes

P‐6.8: Study of Mass Transfer for Micro‐LED Manufacturing

High-yield Micro-LED laser transfer accomplished using an ablation-type release material

P‐161: Full‐in‐situ Imaging and Laser Processing System Supporting Detection and Removal of Defective Micro‐LED Dies During Mass Transfer

Mass transfer for Micro-LED display: Transfer printing techniques

Super retina TFT based full color microLED display via laser mass transfer

23‐3: Application of Laser‐Assisted Bonding in Micro‐LED display technology

P‐10.1: Transfer Process of Micro‐LED Using Laser

Micro-LED Mass Transfer Technologies

P‐85: Development of High‐yield Laser Lift‐off Process for Micro LED Display

91‐1: Invited Paper: Micro‐LED Stamp Transfer & Repair Technology for Tiling Display

Research Progress of Micro-LED Display Technology

25.6: A Study on Micro‐LED Stamp Transfer Technology: Requirement and Challenges

An Alternative Micro LED Mass Transfer Technology: Self-Assembly

Continuous wave laser fabrication of small pitch/size perovskite pixels realizes high-resolution color conversion micro-LED displays

P‐105: Micro LED Total Repair Solutions for Display Application: EHD Printing, 1‐by‐1 Transfer, and Functional Nano‐ink material

P‐5.6: 5um Micro‐LED Display Adopting Mass Transfer Technology and Characteristics of GaN Micro‐LED on it

Challenges of high-yield manufacture in micro-light-emitting diodes displays: chip fabrication, mass transfer, and detection

24.1: Invited Paper: Micro‐LED 4.78 inch Tiled Display Modules with 100% Yield Achieved by Stamp Transfer Technology