Abstract:Micro LED display technology has been spotlighted as the most promising technology compared to LCD and OLED. Its excellent advantages include higher brightness, self-illumination, higher resolution, lower power consumption, faster response, higher integration, higher stability, thinner thickness, longer life, etc. In terms of the unique benefits, it is attracting increasing attention from industries. With the commercialization of Micro LED technology, the following hurdles are identified: wafer manufacturing, full color, bonding, and mass transfer. Among them, mass transfer is so far considered as the most severe bottleneck. Several mass transfer technologies have emerged, including fine picking and placing, roll printing, laser transferring, and fluid self-assembly, which aim to solve the mass transfer problems. However, the aforementioned first 3 types of technologies still rely on the pick-and-place process, which is limited when the Micro LED die dimension shrinks to smaller scales due to processability and equipment precision. Fluidity self-assembly, on the other hand, will not be constrained by the Micro LED size and machine accuracy in the mass transfer process, which received increasing attention from researchers. In the self-assembly of component level, gravitational attraction, magnetic /electromagnetic fields, and capillary force are considered the mainstream force to facilitate the assembly process. Therefore, the component self-assembly becomes a prospective substitute for the Micro LED mass transfer solution, which overcomes the problems of the trade-off between throughput and the placement accuracy of the pick-and-place technology.

P‐10.1: Transfer Process of Micro‐LED Using Laser

Mass transfer for Micro-LED display: Transfer printing techniques

High-yield Micro-LED laser transfer accomplished using an ablation-type release material

Super retina TFT based full color microLED display via laser mass transfer

84‐4: Transfer of Flip‐Chip Structure micro‐LED from Sapphire to Thin Film

Efficient Mini/Micro-Perovskite Light-Emitting Diodes

Mass transfer, detection and repair technologies in micro-LED displays

P‐85: Development of High‐yield Laser Lift‐off Process for Micro LED Display

Micro-LED Mass Transfer Technologies

P‐6.8: Study of Mass Transfer for Micro‐LED Manufacturing

Laser-Driven Micro Transfer Placement of Prefabricated Microstructures

Highly Effective Transfer of Micro-LED Pixels to Intermediate and Rigid Substrate with Weak and Tunable Adhesion by Thiol Modification

Fs Pulse Laser-Induced Micro-LED Transfer Process

Continuous wave laser fabrication of small pitch/size perovskite pixels realizes high-resolution color conversion micro-LED displays

Integration Technology of Micro-LED for Next-Generation Display

P‐9.2: GaN HEMT‐LED Homogeneous Integration for Micro‐LED Mass Transferring

P‐6.2: A Study on Micro‐LED Selective Repair Technology for Mass Production Purpose

P‐161: Full‐in‐situ Imaging and Laser Processing System Supporting Detection and Removal of Defective Micro‐LED Dies During Mass Transfer

Research Progress of Micro-LED Display Technology

Advanced Mechanical Transfer of Micro-LEDs Enabled by Structurally Modified Wide Sapphire Nanomembranes through Thermal Reflow of Photoresist.

An Alternative Micro LED Mass Transfer Technology: Self-Assembly