Abstract:The study has developed a roll‐to‐plate (R2P) transfer technique with overlay alignment capabilities, where gradual positional errors are analyzed during micro‐LED transfer and present a straightforward solution. As a demonstration, micro‐LEDs are successfully transferred to a transparent circuit board (TCB), achieving a transparent display with 72.5% transparency. Transparent displays are crucial for various applications, particularly for their potential use as windows in future self‐driving cars. These displays require high transparency, low power consumption, and high mechanical reliability. Micro‐LEDs have emerged as ideal devices for the transparent displays. Efficient mass‐production processes are essential for the commercialization of transparent micro‐LED displays. This study presents roll‐based mass transfer to enhance the productivity of transparent micro‐LED displays. Roll transfer processes traditionally face resolution challenges in alignment repeatability and positional errors in both the transverse direction (TD) and machine direction (MD). This study proposes a roll‐to‐plate (R2P) transfer process with overlay alignment to improve the repeatability precision of the alignment. Detailed experimental analyses address positional errors in the TD and MD, attributed to initial contact errors and linear velocity asynchrony, respectively. The results demonstrate successful micro‐LED transfer onto a transparent circuit board (TCB) with a maximum positional error of 3.2 μm and a 99.75% yield. The resulting micro‐LED display achieves a transparency of 72.5% with 68 pixels per inch. This study overcomes the alignment challenges in the R2P process and contributes to the commercialization of transparent micro‐LED displays. It is expected to positively impact the manufacturing of transparent applications that involve rolling processes.

Fs Pulse Laser-Induced Micro-LED Transfer Process

High-yield Micro-LED laser transfer accomplished using an ablation-type release material

Advancing Integrated Photonics and Microreactor Technologies with Ultrafast Laser Processing

Laser-Driven Micro Transfer Placement of Prefabricated Microstructures

Toward On-Chip Unidirectional and Single-Mode Polymer Microlaser

P‐10.1: Transfer Process of Micro‐LED Using Laser

Advanced Mechanical Transfer of Micro-LEDs Enabled by Structurally Modified Wide Sapphire Nanomembranes through Thermal Reflow of Photoresist.

Super retina TFT based full color microLED display via laser mass transfer

84‐4: Transfer of Flip‐Chip Structure micro‐LED from Sapphire to Thin Film

Mass transfer for Micro-LED display: Transfer printing techniques

Blister-based-laser-induced-forward-transfer: a non-contact, dry laser-based transfer method for nanomaterials

P‐161: Full‐in‐situ Imaging and Laser Processing System Supporting Detection and Removal of Defective Micro‐LED Dies During Mass Transfer

Transfer of Micro‐LEDs with Roll‐Based Direct Overlay Alignment for Manufacturing Transparent Displays

Highly Effective Transfer of Micro-LED Pixels to Intermediate and Rigid Substrate with Weak and Tunable Adhesion by Thiol Modification

P‐85: Development of High‐yield Laser Lift‐off Process for Micro LED Display

Micro-LED Mass Transfer Technologies

Polymer Reinforced Solder Paste for Improving Impact Energy Absorption Capability in Micro LED Laser-Assisted Mass Transfer

Technological Breakthroughs in Chip Fabrication, Transfer, and Color Conversion for High-Performance Micro-LED Displays

P‐6.2: A Study on Micro‐LED Selective Repair Technology for Mass Production Purpose

Recent Advences in Laser and Laser-Assisted Bonding (LAB) Technologies for Micro-Soldering and Applications to Mini-LED

Powerful laser miniaturized from tabletop to microchip