Abstract:A novel method for the fabrication of micro gold electrodes on polystyrene (PS) sheets by UV-directed electroless plating was developed. The microelectrode pattern was transferred onto the surface of PS sheets by exposure of the surface to UV-lights emitted from a low-pressure mercury lamp through a photo-mask. The carboxyl moieties photo-chemically generated on the UV-exposed region were used as the scaffold for further surface modifications. After amination of the carboxyl groups with ethylenediamine, adsorption of Au(III) ions by the tethered free amine groups, and reduction of the adsorbed Au(III) with NaBH4, a layer of gold nano-particles that served as seeds to catalyze the electroless plating was formed on the UV-exposed region (so-called being activated). Gold microelectrodes were then selectively plated onto the activated area by using an electroless gold plating bath. Water contact angle, attenuated total reflection fourier transformation infrared (ATR-FT-IR) spectroscopy, X-ray photoelectron spectroscopy (XPS), and chemical mapping were employed to trace the surface changes during the activation process. The prepared microelectrodes showed strong adhesion to the substrates, good stability in strong acidic and alkaline solutions, and good electrochemical properties similar to standard gold-disk electrodes. The fabricated gold microelectrodes were used as the electrode bases of the three-electrode system for amperometric detection in a full PS micro electrophoresis chip, which was demonstrated for separation and detection of model analytes of dopamine (DA) and catechol (CA).

Fabrication of Ni Microbumps With Small Feature Size on Au Using Electroless Ni Plating With Noncontact Induction

Electroless Deposition of 4 μm High Ni/Au Bumps for 8 μm Pitch Interconnection

Laser-Based Fabrication of Microstructures on Nickel Thin Films and Its Applications in On-Chip Thin Film Inductors

23‐2: Invited Paper: Fabrication of Super Uniform Nickel Bumps Using Electroless Plating on Micro‐LEDs’ TFT Driver Substrates

Fabrication of Metal Nanoelectrodes by Interfacial Reactions

Research on Ni3Sn4 Intermetallic Compound for 5 M Diameter Cu/Ni/Sn-3.0Ag Micro Bumps

Characterization of sintered Cu nanopaste for micro-bumping with Injection Molded Solder technology

Fabrication of gold microelectrodes on polystyrene sheets by UV-directed electroless plating and its application in electrochemical detection

Fabrication of Cu-Ni Alloy Microcomponents using Localized Electrochemical Deposition

Research of gold bump for wafer level package

Fabrication of Pb/Sn Bumps

Fabrication of Large Scale Bi-layer Microstructure through Electrochemical Nanoimprinting

Fabrication of Fine-Pitch Cu-Sn Microbumps Using Electroplating and Wet Seed Layer Etching

Electrochemical Deposition of Pure-Nickel Microstructures with Controllable Size

Nanostructured Gold Microelectrodes for SERS and EIS Measurements by Incorporating ZnO Nanorod Growth with Electroplating.

Effect of Ag addition on the mechanical properties of Cu/Ni/Sn/Ni/Cu microbump with a sub-10 micron bump thickness

Fabrication of high-aspect-ratio metallic microstructures by microelectroforming using silver-coated polydimethylsiloxane molds with controllable wettability

Vertical Interconnections by Electroless Au Deposition on Electroless Ni Immersion Au Surface Finish

Processing and Characterization of Precision Microparts from Nickel-based Materials

Electro-Brush Plating from Deep Eutectic Solvent: A Case of Nanocrystalline Ni Coatings with Superior Mechanical Property and Corrosion Resistance

Controllably Constructing Gold Nanostructures on Electrodes Through Growth of Zinc Oxide Nanorods and Two-Step Electroplating