Abstract:Heterogeneous integration (HI) and advanced packaging technology have been taken notice of semiconductor industry because it was believed as an alternative to overcome the slowing-down of Moore’s law, by splitting a chip into a few ones and then integrating them again. Especially, hybrid copper bonding (HCB) was considered an ideal methodology because it could integrate such chiplets having extremely high interconnect density. However, there were some difficulties like sensitive copper dishing and particle control, and those challenged a quick settlement of this promising technology. Therefore, it will be helpful to share these challenges by improving and extending micro-bump technology. This paper explored the thermal stability of newly applied micro-bump metallurgies with a noble flux-less bonding process to improve and extend conventional micro-bump technology. Micro-bumps of 14 μm pitch were electroplated on a 77 mm x 77 mm coupon silicon wafer, and Flux-Less Oxide-removal Laser Assembly, FLOLA is applied to interconnect 11 mm x 11 mm chips on a coupon. Before the bonding process, Ar/H2 atmospheric plasma pre-treatment was carried out to remove tin-oxide on the surface of SnAg solder and, there was neither fluxing nor cleaning. Underfill encapsulation followed and a high-temperature storage (HTS) test was carried out to verify diffusion behavior for 14 μm pitch micro-bumps. New metallurgy micro-bumps (M-SnAg), consisting of a new metal pillar (M) and diffusion barrier, showed superior thermal stability and much lower intermetallic compound (IMC) growth compared to both Cu-SnAg and Ni-SnAg bump, even after 2000hrs of iso-thermal aging at 180°C.

Efficiency analysis of electroplating gold bump in assembly

Research of gold bump for wafer level package

Method to Improve the Process Efficiency for Copper Pillar Electroplating

Assembly Accuracy Analysis for Small Components with A Planar Surface in Large-Scale Metrology

Design and Control of Horizontal Extension for Gold Bumping

23‐2: Invited Paper: Fabrication of Super Uniform Nickel Bumps Using Electroless Plating on Micro‐LEDs’ TFT Driver Substrates

Optimization of Micro-interconnection Distribution of Gold Stud Bumps for Thermo-sonic Flip Chip Bonding

Electroless Deposition of 4 μm High Ni/Au Bumps for 8 μm Pitch Interconnection

Au Plating Failure Prevention on the Electronic Industry

Electroplating of Cu/Sn bumps with ultrafine pitch and high uniformity for micro-LED interconnection

Electroless deposition of high-uniformity nickel microbumps with ultrahigh resolution of 8 μm pitch for monolithic Micro-LED display

Solderability Of Flash Gold Surface Finish

Reliability Analysis of Flip-Chip Packaging GaN Chip with Nano-Silver Solder BUMP

Numerical simulation of optimizing plating uniformity of gold plating

Stress analysis of "Micro-Bump Bonding" structure for "Chip on glass" packaging

Fabrication of Fine-Pitch Cu-Sn Microbumps Using Electroplating and Wet Seed Layer Etching

Numerical Simulation of Optimizing Plating Uniformity of Interconnect Circuits on Printed Circuit Boards

Failure Analysis of Debonding of Gold on Electrolytic Nickel and Gold

A Study on Improvement and Extension of Fine-Pitch Micro-Bump Interconnects Technology: New Metallurgy & Flux-Less Oxide-removal Laser Assembly (FLOLA)

Fabrication and Mechanical Properties Improvement of Micro Bumps for High-Resolution Micro-LED Display Application

The Research on a Low Cost Flip Chip Bumping Process by Stencil Printing