Simulation and Optimization on the Uniformity of the Electroplating film

Dong Jiuchao
Abstract:In this paper,electric field distribution of plating process is simulated with ANSYS.In order to improve the uni- formity after plating the model were mended by adding the auxil- iary measure.It is found that after adding a flat baffle with a hole between cathode and anode,the surface is more flat.When the baffle's diameter is 5 centimeters and the distance to cathode is 5. 25 centimeters,the error of the surface decreases from 41.8% to 24.3%.So by doing the experiment,the simulation has the co- herence with the experiment.The experiment verifies the simula- tion.
Materials Science,Engineering
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