Numerical simulation of nickel electroforming process influenced by flow field

Hao Sun,Xiang Wang
DOI: https://doi.org/10.1109/NEMS.2015.7147478
2015-01-01
Abstract:A theoretical model of nickel electroforming within the patterned photo-resist microstructures is proposed. Fluid flow, transport of ion species and electrode reaction kinetics are fully coupled in this model to characterize the electroforming system. Numerical simulations of the electroforming process are carried out using a finite element method. By analyzing time variation of the reaction ions concentration distribution and evolution of the deposition surface, the effects of flow field on the electroforming process in microstructures of different aspect ratios are investigated.
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