Numerical solution and experimental study of Multi-field coupling for nickel-based coatings prepared by scanning electrodeposition at different currents

Xiuqing Fu,Yichen Tao,Hongbiao Wang,Hongwen Zhang,Jieyu Xian,Yifan Zhu

DOI: https://doi.org/10.1177/09544054221143264

2022-12-25

Abstract:Proceedings of the Institution of Mechanical Engineers, Part B: Journal of Engineering Manufacture, Ahead of Print. In this study, a dynamic grid mathematical model of scanning electrodeposition coupled with electric field, flow field, temperature field and concentration field was established. The transient distribution of multiple physical fields with different current densities (I was 0.075–0.275 A) and the growth of the coating were investigated. The preparation, morphology characterization and performance testing of nickel-based coatings were carried out. The results showed that the transient distribution of multiple physical fields reflected the deposition rule of the coating, and explains the deposition phenomenon of the coating with an "arch-shaped" distribution in the test. With the increase of current, the thickness of the coating and the degree of the arch increased. The numerical solution was consistent with the experimental law. The hardness, wear resistance and corrosion resistance of the coating increased first and then decreased. When I was 0.175 A (current densities was 700 A/m2), the maximum hardness of the nickel-based coating was 668.88 HV0.1, the minimum wear scar area was 1144.74 μm2, and the maximum equivalent resistance was 10,960 Ω. The temperature and concentration fields had little influence on the deposition process, and changes were only observed on the deposition surface. Electric and flow field distributions had greater influences on the deposition process, were the main reason for "arch-shaped" distribution.