Study of wetters in nickel electroforming of 3D microstructures

Zen-Jei Wei,Yung-Yun Wang,Chi-Chao Wan,Chein-Ho Huang
DOI: https://doi.org/10.1016/S0254-0584(99)00228-X
IF: 4.778
2000-01-01
Materials Chemistry and Physics
Abstract:The effect of the presence of a wetter upon nickel electroforming of three-dimensional (3D) microstructure under various aspect ratios and applied current densities was investigated. Owing to improved wetting capacity, the height-to-width aspect ratio of the nickel microstructure and the applied current density were favorably enhanced with the presence of soluble dialkyl esters of sodium sulfosuccinic acid in the electrolyte. A nickel microstructure with aspect ratio 30 (200μm deep with 7μm width) was obtained at 16Adm−2. The internal stress and hardness of the nickel deposit were slightly decreased by the presence of these wetters.
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