Behavior of KI in Acidic Electroless Plating Ni-P Solution

聂书红,蔡珣,陈秋龙,符长璞,夏承钰
DOI: https://doi.org/10.3969/j.issn.1000-3738.2002.05.002
2002-01-01
Abstract:The effects of stablizer KI on the stability, deporsition rate of EN solution, phosphorus content, morphology and corrosion resistance of Ni P coating were investigated. The differences between Pb 2+ ,H 2NCSNH 2,S 2O 2- 3,MoO 2- 4,La 2+ ,Ce 4+ ,Pr 4+ ,Nd 3+ ,and Sm 3+ were contrasted.The results showed that KI was a highly efficient stablizer with constant deposition rate in a very wide content range.In addition, KI had a little influence on the stability, deposition rate of EN solution and the phosphorus content, morphology and corrosion resistence of Ni P coating. Developing composite stablizer containing KI would yield more ideal results.
What problem does this paper attempt to address?