Behavior of CrCl3 in Acidic Electroless Plating Ni-Cu-P Solution

聂书红,刘佑铭,蔡珣,赵启翮,杨振炜,陈秋龙
DOI: https://doi.org/10.3321/j.issn:1006-2467.2003.10.012
2003-01-01
Shanghai Jiaotong Daxue Xuebao/Journal of Shanghai Jiaotong University
Abstract:The effects of CrCl3 on the stability and deposition rate of acidic Ni-Cu-P solution, composition and performance of the coating and surface, sectional morphology of Ni-Cu-P coating were investigated. The differences between those with CrCl3 as stablizer and the other stablizers reported were compared. The results show that CrCl3 can effectively inhibit the decomposition of Ni-Cu-P plating solution and the replacement reaction occurrance of Cu on substrate. The deposition rate firstly increases, then decreases with the increasing CrCl3 content; the coatings with CrCl3 in solution have more Cu content and less Ni and P content. Like other stablizers, CrCl3 does not change the island surface morphology of coatings and the coatings are sound according to the sectional morphology. The performance of the coating with CrCl3 in plating solution is better than that of the other stablizers reported in Ni-Cu-P solution.
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