Effects Of Nh4f On Electroless Ni-P Plating Bath And Properties Of Coatings

Ying Hua-Gen,Luo Wei,Yan Mi
DOI: https://doi.org/10.3321/j.issn:1001-4861.2007.02.019
2007-01-01
Chinese journal of inorganic chemistry
Abstract:The deposition rate and buffering capability of electroless Ni-P plating were studied by ammonium fluoride addition. SEM images show that the coating surface is finer when ammonium fluoride is added in the bath. The electrochemical measurements show that the corrosion resistance of the Ni-P coatings from the bath with ammonium fluoride is greatly improved. EDS shows that the distribution of phosphorus of the coating from the bath with ammonium fluoride is much more uniform than the coating from the original bath, and the surface microhardness is also improved. Ammonium fluoride is proved to be an excellent buffering agent.
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