Fabrication of Large-Area Field-Emission Arrays by Bonding Technology

QA HUANG,T XIANG,M QIN,JN CHEN,HZ ZHANG,QY TONG
DOI: https://doi.org/10.1360/sb1993-38-22-1866
1993-01-01
Chinese Science Bulletin
Abstract:1 Introduction The recent development of vacuum microelectronics has received much attention. Vacuum microelectronic devices combine the vacuum transport of electrons with the microfabrication in the IC industry, and show a prospect of wide applications. If the devices can operate at moderate voltages, the electric field of about 1×10~7 V/cm is required. Sharp cathodes have to be fabricated so as to intensify the electric field near cathodes under a voltage. It is obvious that the fabrication of sharp cathodes is one of the key
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