Increased surface flashover voltage in microfabricated devices

R. C. Sterling,M. D. Hughes,C. J. Mellor,W. K. Hensinger

DOI: https://doi.org/10.1063/1.4824012

2014-04-25

Abstract:With the demand for improved performance in microfabricated devices, the necessity to apply greater electric fields and voltages becomes evident. When operating in vacuum, the voltage is typically limited by surface flashover forming along the surface of a dielectric. By modifying the fabrication process we have discovered it is possible to more than double the flashover voltage. Our finding has significant impact on the realization of next-generation micro- and nano-fabricated devices and for the fabrication of on-chip ion trap arrays for the realization of scalable ion quantum technology.

Materials Science,Quantum Physics

What problem does this paper attempt to address?

This paper attempts to solve the problem of surface flashover voltage limitation faced by micro - fabricated devices when operating in a vacuum environment. Specifically, when these devices need to apply higher electric fields and voltages to improve performance, surface flashover becomes the main limiting factor. Surface flashover refers to the electrical breakdown phenomenon that occurs along the surface of dielectric materials, which will limit the maximum voltage that can be applied, thus affecting the function and reliability of the device.

### Specific manifestations of the problem

1. **High - voltage requirement**: In order to achieve a larger ion - electrode spacing and a smaller electrode spacing, devices such as micro - fabricated ion traps need to apply higher voltages.
2. **Surface flashover limitation**: In micro - fabricated devices, because the electrode spacing is very small (a few micrometers), surface flashover is likely to occur, leading to electrical breakdown and damaging the device.
3. **Ion heating problem**: Ions close to the electrode surface will cause abnormal heating, affecting the motion state of ions. Especially when the ion - electrode spacing is small, this effect is more obvious.
4. **Long - term stability**: The exposed dielectric material surface may accumulate uncontrolled charges, affecting the long - term stability and performance of the device.

### Solutions

The paper proposes a method to significantly increase the surface flashover voltage by improving the micro - fabrication process. Specific measures include:

1. **Selecting appropriate dielectric materials**: Experiments show that using silicon nitride (aSiN) as a dielectric material can significantly increase the surface flashover voltage compared to using silicon dioxide (aSiO). Silicon nitride shows an approximately 3.6 - fold increase in flashover voltage.
2. **Optimizing the manufacturing process**: By introducing pre - treatment steps such as oxygen plasma etching, the density of adsorbed gas molecules can be further reduced, thereby increasing the flashover voltage.
3. **Multi - layer structure design**: Adopting a multi - layer dielectric structure can prevent the formation of pinholes, reduce the risk of electrical breakdown, and maintain good electrical insulation performance.

### Impact and significance

This research is not only of great significance for the optimization of micro - fabricated ion trap arrays, but also provides new ideas and technical means for other micro - fabricated devices that need to operate in a vacuum (such as MEMS, NEMS, field - emission arrays, etc.). By increasing the surface flashover voltage, the electrode spacing can be reduced, and the exposed dielectric surface area can be reduced, thereby improving the overall performance and reliability of the device.

### Conclusion

The paper shows that by selecting appropriate dielectric materials and optimizing the manufacturing process, the surface flashover voltage of micro - fabricated devices in a vacuum environment can be significantly increased, which has an important impact on the realization of next - generation micro - and nano - fabricated devices and scalable ion - quantum technologies.